Lens driving device, and camera module and optical device including same

ABSTRACT

An embodiment comprises: a housing; a bobbin disposed in the housing; a first coil disposed on the bobbin; a magnet disposed at the housing; an elastic part coupled to the bobbin and the housing; a circuit board disposed under the housing and comprising a pad part; a base disposed under the circuit board; a terminal disposed on the base; and a support part, one end of which is coupled to the elastic part and the other end of which is coupled to the terminal, wherein the pad part comprises: a first pad disposed beneath the circuit board; a second pad on the circuit board; and a third pad connecting the first pad and the second pad.

CROSS REFERENCE TO RELATED APPLICATIONS

This application is the National Phase of PCT/KR2018/009500 filed onAug. 20, 2018, which claims priority under 35 U.S.C. § 119(a) to PatentApplication Nos. 10-2017-0109994 and 10-2017-0149252 filed in theRepublic of Korea on Aug. 30, 2017 and Nov. 10, 2017, respectively, allof which are hereby expressly incorporated by reference into the presentapplication.

TECHNICAL FIELD

Embodiments relate to a lens moving apparatus and to a camera module andan optical device each including the same.

BACKGROUND ART

Technology of a voice coil motor (VCM), which is used in existinggeneral camera modules, is difficult to apply to a miniature low-powercamera module, and studies related thereto have been actively conducted.

In the case of a camera module configured to be mounted in a smallelectronic product, such as a smart phone, the camera module mayfrequently receive shocks when in use, and may undergo fine shaking dueto, for example, the shaking of a user's hand. In consideration thereof,technology enabling a device for preventing handshake to be additionallyinstalled to a camera module is being developed.

SUMMARY

Embodiments provide a lens moving apparatus capable of improving ease ofsoldering of a circuit board to terminals and preventing electricaldisconnection of the terminals from the circuit board, and to a cameramodule and an optical device each including the same.

A lens moving apparatus according to an embodiment comprises a housing,a bobbin disposed inside the housing, a first coil disposed at thebobbin, a magnet disposed at the housing, an elastic member coupled bothto the bobbin and to the housing, a circuit board disposed under thehousing and including a pad portion, a base disposed under the circuitboard, a terminal disposed at the base, and a support, which is coupledat one end thereof to the elastic member and at a remaining end thereofto the terminal, wherein the pad portion comprises a first pad disposedat a lower portion of the circuit board, a second pad disposed at anupper portion of the circuit board and a third pad connecting the firstpad to the second pad.

The terminal may include a first coupler coupled to the remaining end ofthe support, a second coupler coupled to the pad portion of the circuitboard, and a connector connecting a portion of one side surface of thefirst coupler to a portion of one side surface of the second coupler.

The circuit board may have a groove formed at a position correspondingto the second coupler of the terminal, and a portion of the third pad isdisposed in the groove.

The circuit board may have a through via formed at a positioncorresponding to the second coupler of the terminal, and a portion ofthe third pad may be disposed in the through via.

The circuit board may comprise a first insulation layer, a firstconductive layer disposed on an upper surface of the first insulationlayer, a second conductive layer disposed on a lower surface of thefirst insulation layer, and a third insulation layer disposed on a lowersurface of the second conductive layer,

wherein the first pad is disposed on the lower surface of the secondconductive layer, and the second pad is disposed on the upper surface ofthe first conductive layer, and

wherein a lower surface of the first pad is disposed higher than a lowersurface of the third insulation layer of the circuit board.

A surface area of the first pad may be larger than a surface area of thesecond pad.

The lens moving apparatus may further comprise solder disposed betweenthe first pad and the second coupler.

A width of the connector may be less than a length of one side surfaceof the first coupler and a length of one side surface of the secondcoupler.

The connector may comprise a curved portion or a bent portion.

A horizontal distance between the first coupler and the second couplermay be less than a length of the second coupler in a horizontaldirection, the horizontal direction being perpendicular to a widthdirection of the connector.

Advantageous Effects

Embodiments are able to improve ease of soldering of a circuit board toterminals and to prevent electrical disconnection of the terminals fromthe circuit board.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a perspective view of a lens moving apparatus according to anembodiment;

FIG. 2 is a view illustrating the assembled lens moving apparatus, fromwhich a cover member is removed;

FIG. 3 is a perspective view of a bobbin;

FIG. 4 is a perspective view of a housing;

FIG. 5 is a perspective view of a first elastic member, a second elasticmember, supports, a second coil, a circuit board and a base;

FIG. 6 is a perspective view of the second coil, the circuit board andthe supports;

FIG. 7 is an exploded perspective view of the circuit board and thesecond coil, which are disposed at the base;

FIG. 8 is a fragmentary enlarged view of the base and the circuit boardshown in FIG. 7 ;

FIG. 9 is a bottom view of the circuit board including the second coil;

FIG. 10A is an exploded perspective view of the base, a location sensorand terminals;

FIG. 10B is a bottom view of the base;

FIG. 10C is an assembled perspective view of the base and the terminals;

FIG. 11 is a perspective view of the first terminal and the firstsupport;

FIG. 12 is a fragmentary assembled perspective view of the base, thefirst terminal and the circuit board, which are coupled to one another;

FIG. 13 is a bottom view of the circuit board;

FIG. 14 illustrates solders for coupling the terminals to the supports;

FIG. 15 is a cross-sectional view of a pad portion of the circuit board;

FIG. 16 is a cross-sectional view of the lens moving apparatus shown inFIG. 2 , taken along line A-B;

FIG. 17A illustrates the coupling between the circuit board and theterminal using the solder;

FIG. 17B illustrates the coupling between the pad portion of the circuitboard and the terminal according to an embodiment;

FIG. 18A is a perspective view of the first terminal and the firstsupport according to another embodiment;

FIG. 18B is a perspective view of the first terminal shown in FIG. 18A;

FIG. 18C is a perspective view of the first terminal and the firstsupport according to another embodiment;

FIGS. 19A to 19E illustrate connectors of the first terminal accordingto other embodiments;

FIG. 20 is an exploded perspective view of a camera module according toan embodiment;

FIG. 21 is a perspective view of a portable terminal according to anembodiment; and

FIG. 22 is a view illustrating the configuration of the portableterminal illustrated in FIG. 21 .

DETAILED DESCRIPTION

Hereinafter, embodiments of the present invention capable of concretelyachieving the above objects will be described with reference to theaccompanying drawings.

In the following description of the embodiments, it will be understoodthat, when an element is referred to as being formed “on” or “under”another element, it can be directly “on” or “under” the other element,or can be indirectly disposed, with one or more intervening elementstherebetween. In addition, it will also be understood that “on” or“under” the element may mean an upward direction or a downward directionbased on the element.

In addition, relative terms such as, for example, “first”, “second”,“on/upper/above” and “beneath/lower/below”, used in the followingdescription may be used to distinguish any one substance or element withanother substance or element without requiring or containing anyphysical or logical relationship or sequence between these substances orelements. The same reference numeral designates the same elementthroughout all the drawings.

Unless otherwise defined, the terms “comprise,” “include” or “have” usedin the above description are used to designate the presence of features,steps or combinations thereof described in the specification, and shouldbe understood so as not to exclude the presence or probability ofadditional inclusion of one or more different features, steps orcombinations thereof. Furthermore, the terms “correspond” or the likemay include at least one of designations of “face” or “overlap”.

For the convenience of description, although the lens moving apparatusis described using a rectangular coordinate system (x, y, z), the lensmoving apparatus may be described using some other coordinate systems,and the embodiments are not limited thereto. In the respective drawings,the X-axis and the Y-axis mean directions perpendicular to an opticalaxis, i.e. the Z-axis, and the optical axis (Z-axis) direction or adirection parallel to the optical axis may be referred to as a “firstdirection”, the X-axis direction may be referred to as a “seconddirection”, and the Y-axis direction may be referred to as a “thirddirection”.

A “handshake correction device”, which is applied to a subminiaturecamera module of a mobile device such as, for example, a smart phone ora tablet PC, may be a device that is configured to prevent the contourline of a captured image from being indistinctly formed due to vibrationcaused by shaking of the user's hand when capturing a still image.

In addition, an “auto-focusing device” is a device that automaticallyfocuses an image of a subject on an image sensor surface. The handshakecorrection device and the auto-focusing device may be configured invarious ways, and the lens moving apparatus according to an embodimentmay move an optical module, which is constituted of at least one lens,in the first direction, which is parallel to the optical axis, orrelative to a plane defined by the second and third directions, whichare perpendicular to the first direction, thereby performing handshakecorrection motion and/or auto-focusing.

FIG. 1 is an exploded view of a lens moving apparatus 100 according toan embodiment. FIG. 2 is a view illustrating the assembled state of thelens moving apparatus 100, from which a cover member 300 is removed.

Referring to FIGS. 1 and 2 , the lens moving apparatus 100 may include abobbin 110, a first coil 120, magnets 130, a housing 140, a firstelastic member 150 and a second elastic member 160.

The lens moving apparatus 100 may further include supports 220 and abase 210.

The lens moving apparatus 100 may further include a second coil 230 forOIS (optical image stabilization) operation, and may further include alocation sensor 240 for OIS feedback operation.

The lens moving apparatus 100 may further include a cover member 300.

The cover member 300 will be described.

The cover member 300 accommodates the components 110, 120, 130, 140,150, 160, 220 and 250, in the space defined between the cover member 300and the base 210.

The cover member 300 may take the form of a box that has an open bottomand includes a top plate and side plates. The bottom of the cover member300 may be coupled to the base 210. The top plate of the cover member300 may have a polygonal shape, for example, a square or octagonalshape.

The cover member 300 may have an opening formed in the top plate thereofin order to expose a lens (not shown), coupled to the bobbin 110, tooutside light. Although the material of the cover member 300 may be anon-magnetic material such as, for example, SUS in order to prevent thecover member 300 from being attracted by the magnets 130, the covermember 300 may be formed of a magnetic material, and may thus functionas a yoke for increasing the electromagnetic force caused by interactionbetween the first coil 120 and the magnet 130.

Next, the bobbin 110 will be described.

The bobbin 110 may allow a lens or a lens barrel to be mounted thereon,and may be disposed inside the housing 140. The bobbin 110 may beconfigured to have an opening so as to allow a lens or a lens barrel tobe mounted therein. Although the shape of the opening may be a circularshape, an elliptical shape or a polygonal shape, the disclosure is notlimited thereto.

FIG. 3 is a perspective view of the bobbin 110.

Referring to FIG. 3 , the bobbin 110 may include a plurality of sideportions (for example, 110 b-1 and 110 b-2).

For example, the bobbin 110 may include first side portions 110 b-1corresponding to the magnets and second side portions 110 b-2 disposedbetween the first side portions.

For example, the horizontal length of the side surface of the first sideportion 110 b-2 of the bobbin 110 may be larger than the horizontallength of the side surface of the second side portion 110 b-2. However,the disclosure is not limited thereto, and the two lengths may be thesame.

The bobbin 110 may include a first stopper 114 projecting from the uppersurface thereof in the first direction. The first stopper 114 of thebobbin 110 may serve to prevent the upper surface of the bobbin 110 fromdirectly colliding with the internal surface of the top plate of thecover member 300 even if the bobbin 110 is moved beyond a specifiedrange due to an external impact or the like when the bobbin 110 is movedin the first direction in order to perform an autofocus function.

The bobbin 110 may include at least one projection 25 projecting fromthe side surface (or the outer surface) of the second side portion 110b-2. For example, the bobbin 110 may include four projections 25provided at the four side portions 110 b-2, without being limitedthereto. In another embodiment, the bobbin 110 may include twoprojections disposed at two side portions 110 b-2 that face each other.

The projection 25 of the bobbin 110 may correspond to a groove 145 inthe housing 140, may be inserted or disposed in the groove 145 in thehousing 140, and may suppress or prevent the bobbin 110 from rotatingbeyond a predetermined range about the optical axis.

The bobbin 110 may include second stoppers (not shown), which projectfrom the lower surface thereof. The second stoppers may serve to preventthe lower surface of the bobbin 110 from directly colliding with thebase 210, the second coil 230 or the circuit board 250 even when thebobbin 110 is moved beyond a specified range due to an external impactor the like when the bobbin 110 is moved in the first direction in orderto perform an autofocus function.

The bobbin 110 may include at least one mounting groove 16 in which thefirst coil 120 is disposed or mounted. For example, the mounting groove16 may be provided at the first side portions 110 b-1 and the secondside portions 110 b-2 of the bobbin 110, without being limited thereto.

The shape of the mounting groove 16 in the bobbin 110 and the numberthereof may correspond to the shape and number of the first coil 120disposed at the side portions of the bobbin 110.

The bobbin 110 may be provided at at least one of the first and secondside portions 110 b-1 and 110 b-2, and may have therein a first groove12 a and a second groove 12 b, which are provided at one or more of thefirst and second side portions 110 b-1 and 110 b-2 and are spaced apartfrom each other.

For example, the first groove 12 a may be provided at one of two firstside portions 110 b-1 of the bobbin 110, which face each other, and thesecond groove 12 b may be provided at the other of the two first sideportions 110 b-1 of the bobbin 110, which face each other.

The first groove 12 a and the second groove 12 b of the bobbin 110 maybe positioned above or on the first coil 120 disposed at the bobbin 110,and may be connected to the mounting groove 16.

A first portion extending from one end of the first coil 120 disposed atthe side portions of the bobbin 110 may be disposed in the first groove12 a, and a second portion extending from the other end of the firstcoil 120 disposed at the side portions of the bobbin 110 may be disposedin the second groove 12 b.

The first portion of the first coil 120 may extend to the upper surfaceof the bobbin 110 so as to be connected to a first outer frame 151 of afirst upper spring 150-1, and the second portion of the first coil 120may extend to the upper surface of the bobbin 110 so as to be connectedto a second outer frame 151 of the second upper spring 150-2.

Although the first coil 120 extends to the upper surface of the bobbin110 so as to be conductively connected to the two upper springs in theembodiment, the disclosure is not limited thereto. In anotherembodiment, the first groove and the second groove may be positionedunder the coil 120, and the first and second portions of the coil mayextend to the lower surface of the bobbin 110 and may be conductivelyconnected to the two lower springs.

In another embodiment, the bobbin 110 may not have the mounting groove16 therein, and the first coil 120 may be directly wound around the sideportions of the bobbin 110 and be secured thereto.

The bobbin 110 may be provided on the upper surface thereof with a firstupper protrusion 113 to which a hole 151 a in the first inner frame 151is coupled.

The bobbin 110 may be provided in the lower surface thereof with a firstlower protrusion (not shown), which is coupled or secured to a hole 161a in the second elastic member 160.

The bobbin 110 may be provided in the inner peripheral surface thereofwith a threaded line for engagement with a lens or a lens barrel. Thethreaded line may be formed in the inner surface of the bobbin 110 inthe state in which the bobbin 110 is held by means of a jig, and theupper surface of the bobbin 110 may have jig-holding grooves formedtherein. For example, the jig-holding grooves may be provided in theupper surfaces of two projections 25 that are opposite each other,without being limited thereto.

Next, the first coil 120 will be described.

The first coil 120 may be a drive coil, which is disposed on the outersurface of the bobbin 110 so as to electromagnetically interact with themagnets 130 disposed on the housing 140.

In order to create electromagnetic force through interaction with themagnets 130, a drive signal (for example, drive current or voltage) maybe applied to the first coil 120.

The drive signal applied to the first coil 120 may be a DC signal. Forexample, the drive signal may be of a current type or a voltage type.

Alternatively, the drive signal applied to the first coil 120 may alsoinclude a DC signal and/or an AC signal. For example, the AC signal maybe a sinusoidal wave or a pulse signal (for example, a pulse widthmodulation (PWM) signal).

An AF operation unit may be moved in the first direction, for example,in an upward direction (in the +z-axis direction) or in a downwarddirection (in the −z-axis direction) by virtue of the electromagneticforce resulting from the interaction between the first coil 120 and themagnets 130. By controlling the intensity and/or polarity of a drivesignal applied to the first coil 120 (for example, the direction inwhich current flows) and thus controlling the intensity and/or directionof the electromagnetic force resulting from the interaction between thefirst coil 120 and the magnets 130, it is possible to control themovement of the AF operation unit in the first direction, therebyperforming an autofocus function.

The AF operation unit may include the bobbin 110, which is elasticallysupported by the first and second elastic members 150 and 160, andcomponents that are mounted on the bobbin 110 and are moved therewith.For example, the AF operation unit may include the bobbin 110 and thefirst coil 120. In another example, the AF operation unit may furtherinclude a lens (not shown) mounted on the bobbin 110.

The first coil 120 may be disposed at the bobbin 110 so as to have aclosed loop shape. For example, the first coil 120 may be wound ordisposed around the outer surface of the side portions 110 b-1 and 110b-2 of the bobbin 110 in a clockwise or counterclockwise direction aboutthe optical axis.

In another embodiment, the first coil 120 may be embodied as a coilring, which is wound or disposed in a clockwise or counterclockwisedirection about an axis perpendicular to the optical axis OA. Althoughthe number of coil rings may be equal to the number of magnets 130, thedisclosure is not limited thereto.

The first coil 120 may be conductively connected to at least one of thefirst elastic member 150 or the second elastic member 160, and may beconductively connected to the circuit board 250 via the first elasticmember 150 or the second elastic member 160 and the supports 220.

For example, the first coil 120 may be connected to the first innerframe 151 of the second and fourth upper springs 160-2 and 150-4 via aconductive adhesive member such as solder, and may be conductivelyconnected to the circuit board 250 via second and fourth supports 220-2and 220-4.

Next, the housing 140 will be described.

The housing 140 accommodates therein the bobbin 110, with the first coil120 mounted or disposed thereon.

FIG. 4 is a perspective view of the housing 140. FIG. 5 is a perspectiveview illustrating the first elastic member 150, the second elasticmember 150, the supports 220, the second coil 230, the circuit board 250and the base 250.

Referring to FIGS. 4 and 5 , the housing 140 may be configured to havethe overall shape of a hollow cylinder, and may include a plurality ofside portions, which define the hole.

For example, the housing 140 includes side portions 141-1 to 141-4,which are spaced apart from each other, and corner portions 142-1 to142-4, which are spaced apart from each other.

For example, the housing 140 may include a first side portion 141-1, asecond side portion 141-2, a third side portion 141-3, a fourth sideportion 141-4, a first corner portion 142-1 positioned between the firstside portion 141-1 and the second side portion 141-2, a second cornerportion 142-2 positioned between the second side portion 141-2 and thethird side portion 141-3, a third corner portion 142-3 positionedbetween the third side portion 141-3 and the fourth side portion 141-3,and a fourth corner portion 142-4 positioned between the fourth sideportion 141-4 and the first side portion 141-1.

Although the side portions 141-1 to 141-4 of the housing 140 maycorrespond to the side portions 110 b-1 of the bobbin 110 and the cornerportions 142-1 to 142-4 of the housing 140 may correspond to the cornerportions 110 b-2 of the bobbin 110, the disclosure is not limitedthereto.

The magnets 130 (130-1 to 130-4) may be disposed or mounted on at leastone of the side portions 141-1 to 141-4 of the housing 140, and thesupports 220; 220-1 to 220-4 may be disposed on the corner portions142-1 to 142-4 of the housing 140.

In order to support or receive the magnets 130-1 to 130-4, the housing140 may include mounts 141 a, which are provided on the inner surfacesof the side portions 141-1 to 141-4.

The side portions 141-1 to 141-4 of the housing 140 may have formedtherein grooves or holes 61, into which an adhesive for attaching themagnets 130-1 to 130-4 to the mounts 141 a of the housing 140 isintroduced. For example, the holes 63 may be through holes.

The side portions 141-1 to 141-4 of the housing 140 may be disposedparallel to the side plates of the cover member 300. The corner portions142-1 to 142-4 of the housing 140 may have formed therein holes 147 athrough which the supports 220 extend.

Although each of the holes 147 a may have a diameter that increases in adirection toward the upper surface from the lower surface of the housing140 in order to allow a damper to be easily applied, the disclosure isnot limited thereto. In another embodiment, the hole 147 a may beconfigured such that the diameter thereof is constant.

Furthermore, the housing 140 may be provided on the upper surfacethereof with stoppers 144 so as to prevent the housing 140 from directlycolliding with the inner surface of the cover member 300. For example,although the second stoppers 144 may be configured to project upwardsfrom the upper surface of at least one of the side portions 141-1 to141-4 of the housing 140, the disclosure is not limited thereto. Inanother embodiment, the stopper of the housing 140 may be disposed at atleast one of the corner portions.

In order to guide positioning of first outer frames 152 of the firstelastic member 150 and to prevent the housing 140 from directlycolliding with the inner surface of the cover member 300 when the firstelastic member 150 is placed on the upper surface of the housing 140,the housing 140 may be provided on the upper surface thereof with secondguide portions 146.

The housing 140 may include at least one second upper protrusion 143,which is provided on the upper surface of at least one of the cornerportions 142 for coupling into holes 152 a and 152 b in the first outerframe 152 of the first elastic member 150.

The upper protrusions 143 may be disposed at at least one of both sidesof the second guide portion 146.

The housing 140 may include at least one second lower protrusion (notshown), which is disposed on the lower surface of the side portions141-1 to 141-4 and/or the corner portions 142-1 to 142-4 so as to becoupled or secured into holes 162 a in second outer frames 162 of thesecond elastic member 160. Although the second lower support protrusions145 may be disposed on the lower surface of at least one of the first tofourth corner members 501 a to 501 d of the housing 140, the disclosureis not limited thereto.

In order to ensure not only paths through which the supports 220 extendbut also spaces that are filled with silicone for damping, the housing140 may have recesses 142 a formed in the lower portions of the cornerportions 142-1 to 142-4. The recesses 142 a in the housing 140 may befilled with, for example, damping silicone.

The housing 140 may have stoppers 149, which are provided on the outersurface of at least one of the side portions 141-1 to 141-4. Thestoppers 149 are intended to prevent the outer surfaces of the sideportions 141-1 to 141-4 of the housing 140 from directly colliding withthe inner surfaces of the side plates of the cover member 300 when thehousing 140 moves in the second direction and/or in the third direction.

In order to prevent the bottom surface of the housing 140 from collidingwith the base 210, the second coil 230 and/or the circuit board 250,which will be described later, the housing 140 may further include astopper (not shown) projecting from the lower surface thereof.

The housing 140 may include a groove 145, which is provided on the innersurface of the corner portions 142-1 to 142-4 so as to correspond to theprojection 25 of the bobbin 110.

Next, the magnets 130 will be described.

The magnets 130 may be disposed at the side portions 141-1 to 141-4 ofthe housing 140 so as to overlap at at least a portion thereof the firstcoil 120 in a direction perpendicular to the optical axis or in thesecond or third direction at the initial position of the bobbin 110. Themagnets 130 may be fitted or disposed in the mounts 141 a of the housing140.

Here, the initial position of the bobbin 110 may be the initial positionof the AF operation unit (for example, the bobbin) in the state in whichpower or a drive signal is not applied to the first coil 120, and may bethe position of the AF operation unit when the first elastic member 150and the second elastic member 160 are elastically deformed by only theweight of AF operation unit.

Furthermore, the initial position of the bobbin 110 may be the positionof the AF operation unit when gravity is applied toward the base 210from the bobbin 110 or toward the bobbin 110 from the base 210.

In another embodiment, the magnets 130 may be disposed on the outersurface of the side portions 141-1 to 141-4 of the housing 140.Alternatively, the magnets 130 may also be disposed on the innersurfaces or the outer surfaces of the corner portions 142 of the housing140.

Although each of the magnets 130 may have a shape corresponding to theshape of a corresponding one of the side portions 141-1 to 141-4 of thehousing 140, that is, a rectangular shape, the disclosure is not limitedthereto. The surface of the magnet 130 that faces the first coil 120 maybe configured to have a curvature that corresponds to or coincides witha corresponding surface of the first coil 120.

Each of the magnets 130 may be a monopolar magnetized magnet, in whichthe first surface of the magnet 130, which faces the first coil 120,becomes an N pole and the opposite (second) surface of the magnet 130becomes an S pole. However, the disclosure is not limited thereto, andthe reverse configuration is also possible. In another embodiment, eachof the first and second surfaces of the magnet 130 may be divided intoan N pole and an S pole.

In another embodiment, each of the magnets 130 may be a bipolarmagnetized magnet, which is divided into two in a directionperpendicular to the optical-axis direction. Here, the magnet 130 may beembodied by a ferrite magnet, an alnico magnet, a rare-earth magnet orthe like.

For example, the magnet 130 may include a first magnet portion, a secondmagnet portion, and a non-magnetic partition wall. The first magnetportion and the second magnet portion may be spaced apart from eachother, and the non-magnetic partition wall may be positioned between thefirst magnet portion and the second magnet portion.

The non-magnetic partition wall is a portion that is almost completelynon-magnetic and which may include a zone having almost no polarity. Thenon-magnetic partition wall may be filled with air or may be made of anon-magnetic material.

Although the number of magnets 130 is four in the embodiment, thedisclosure is not limited thereto, and the number of magnets 130 may betwo or more. Although the first surface of the magnet 130, which facesthe first coil 120, may be planar, the disclosure is not limitedthereto, and the first surface may be curved.

The magnets 130 may include at least two magnets, which are disposed onthe side portions of the housing 140 and which face each other.

Each of the magnets 130-1 to 130-4 may have an approximate rectangularshape. Alternatively, each of the magnets may have a triangular shape ora rhombic shape.

In another embodiment, the housing 140 may be omitted, and the magnets130-1 to 130-4 may be disposed at the cover member 300. In a furtherembodiment, the housing 140 may not be omitted, and the magnets 130-1 to130-4 may be disposed at the cover member 300.

In a further embodiment, the magnets 130-1 to 130-4 may be disposed onthe inner surfaces of the side plates of the cover member 300.

Next, the first elastic member 150, the second elastic member 160 andthe supports 220 will be described.

The first elastic member 150 and the second elastic member 160 may becoupled both to the bobbin 110 and to the housing 140 so as to supportthe bobbin 110.

The first elastic member 150 may be disposed at the upper portion or theupper surface of the bobbin 110 and may be an elastic body.

The second elastic member 160 may be disposed at the lower portion orthe lower surface of the bobbin 110 and may be an elastic body.

For example, the first elastic member 150 may be coupled both to theupper portion, the upper surface or the upper end of the bobbin 110 andto the upper portion, the upper surface or the upper end of the housing140, and the second elastic member 160 may be coupled both to the lowerportion, the lower surface or the lower end of the bobbin 110 and to thelower portion, the lower surface or the lower end of the housing 140.

The supports 220 may support the housing 140 with respect to the base210 and may conductively connect at least one of the first elasticmember 150 and the second elastic member 160 to the circuit board 250.

At least one of the first elastic member 150 and the second elasticmember 160 may be divided or separated into two or more.

For example, the first elastic member 150 may include first to fourthupper springs 150-1 to 150-4, which are spaced apart or separated fromone another.

Although each of the first elastic member 150 and the second elasticmember 160 may be embodied as a leaf spring, the disclosure is notlimited thereto. Each of the first and second elastic members 150 and160 may be embodied as a coil spring, a suspension wire or the like.

Each of the first to fourth upper springs 150-1 to 150-4 may include afirst inner frame 151 coupled to the upper portion, the upper surface orthe upper end of the bobbin 110, a first outer frame 152 coupled to theupper portion, the upper surface or the upper end of the housing 140,and a first frame connector 153 connecting the first inner frame 151 tothe first outer frame 152.

The first inner frame 151 may have formed therein a hole 151 a, to whichthe first upper protrusion 113 of the bobbin 110 is coupled, and thehole 151 a may have at least one slit into which an adhesive member or adamper is disposed.

The first outer frame 152 of each of the first to fourth upper springs150-1 to 150-4 may include a first coupler 510 coupled to acorresponding one of the supports 220-1 to 220-6, a second coupler 520coupled to at least one of the corner portions 141-1 to 141-4 and/or theside portions adjacent thereto of the housing 140, and a connector 530connecting the first coupler 510 to the second coupler 520.

The second coupler 520 may include at least one coupling region coupledto the corner portions 142-1 to 142-4 (for example, the second upperprotrusion 143) of the housing 140. For example, the at least onecoupling region may have therein a hole 152 a.

For example, the second coupler 520 may include a first coupling regionpositioned at one side of the second guide portion 146 of the housing140 and a second coupling region positioned at another side of thesecond guide portion 146, without being limited thereto.

Although each of the coupling regions of the second couplers 520 of thefirst to fourth upper springs 150-1 to 150-4 may be embodied so as toinclude a hole, the disclosure is not limited thereto. In anotherembodiment, the coupling regions may also be embodied as having variousshapes suitable for being coupled to the housing 140, for example,grooves or the like.

For example, the holes 152 a in the second couplers 520 may have atleast one slit for allowing an adhesive member or a damper to beintroduced into the gap between the second upper protrusions 143 and theholes 152 a.

The first coupler 510 may have a hole through which a corresponding oneof the supports 220-1 to 220-4 extends. One end of the one of thesupports 220-1 to 220-2 that extends through the hole in the firstcoupler 510 may be coupled to the first coupler 510 using a conductiveadhesive member or solder 910, and the first coupler 510 may beconductively connected to the one of the supports 220-1 to 220-4.

The first coupler 510 may be a region at which the solder 910 isdisposed, and may include a hole and a region near the hole.

The connector 530 may connect the coupling region of the second coupler520 disposed at each of the corner portions 142-1 to 142-4 to the firstcoupler 510.

For example, the connector 530 may include a first connector 530-1,connecting the first coupling region of the second coupler 520 of eachof the first to fourth upper springs 150-1 to 150-4 to the first coupler510, and a second connector 530-2, connecting the second coupling regionof the second coupler 520 to the first coupler 510.

Although each of the connectors 530 may include a bent portion, which isbent at least once, or a curved portion, which is curved at least once,the disclosure is not limited thereto. In another embodiment, they maybe linear.

The width of the connectors 530 may be smaller than the width of thesecond couplers 520. Accordingly, the connectors 530 may be easilymovable in the first direction, making it possible to distribute thestress applied to the first elastic member 150 and the stress applied tothe supports 220.

Although the couplers 530 may be bilaterally symmetrical with respect tothe reference line in order to support the housing 140 in a balancedstate without eccentricity, the disclosure is not limited thereto. Inanother embodiment, the couplers may not be bilaterally symmetrical.

For example, one end of the first coil 120 may be coupled to the firstinner frame 151 of the second upper spring 151-2 and the other end ofthe first coil 120 may be coupled to the first inner frame 151 of thefourth upper spring 151-4 through soldering.

The second elastic member 160 may include a second inner frame 161coupled to the lower portion, the lower surface or the lower end of thebobbin 110, a second outer frame 162 coupled to the lower portion, thelower surface or the lower end of the housing 140, and a second frameconnector 163 connecting the second inner frame 161 to the second outerframe 162.

The second elastic member 160 may have therein the hole 162 a, which isformed in the second inner frame 161 and which is coupled to the firstlower protrusion of the bobbin 110 via a solder or a conductive adhesivemember, and the hole 162 a, which is formed in the second outer frame162 and which is coupled to the second lower protrusion 147 of thehousing 140.

Each of the first and second frame connectors 153 and 163 of the upperand second elastic members 150 and 160 may be bent or curved at leastonce so as to define a predetermined pattern. The upward and/or downwardmovement of the bobbin 110 in the first direction may be elastically (orflexibly) supported by virtue of positional variation and finedeformation of the first and second frame connectors 153 and 163.

In order to absorb or buffer vibrations of the bobbin 110, the lensmoving apparatus 100 may further include first dampers (not shown), eachof which is disposed between a corresponding one of the upper springs150-1 to 150-4 and the housing 140.

For example, the lens moving apparatus 100 may include the first dampers(not shown), each of which is disposed in the space between the firstframe connector 153 of a corresponding one of the upper springs 150-1 to150-4 and the housing 140.

The lens moving apparatus 100 may include second dampers (not shown),each of which is disposed between a corresponding one of the secondframe connectors 163 of the second elastic members 160 and the housing140.

The lens moving apparatus 100 may further include third dampers (notshown) disposed between the supports 220 and the holes 147 a in thehousing 140.

Furthermore, the lens moving apparatus 100 may further include fourthdampers (not shown), which are disposed at the first couplers 510 andthe first ends of the supports 220.

For example, a damper (not shown) may also be disposed between the innersurface of the housing 140 and the outer peripheral surface of thebobbin 110.

Next, the supports 220 will be described.

Each of the supports 220 may be connected at one end thereof to theelastic member 150 and at the other end thereof to a corresponding oneof the terminals 81 a, 81 b, 81 c and 81 d.

The first ends of the supports 220 may be coupled to the first outerframe of the first elastic member 150 via a solder or a conductiveadhesive member.

The supports 220 may include a plurality of supports. Each of theplurality of supports 220-1 to 220-6 may be coupled to a correspondingone of the first couplers 510 of the upper springs 150-1 to 150-4 viathe solder 901, and may be conductively connected to the first coupler510. For example, each of the plurality of supports 220-1 to 220-4 maybe disposed on a corresponding one of the four corner portions 142-1 to142-4.

The plurality of supports 220-1 to 220-4 may support the bobbin 110 andthe housing 140 such that the bobbin 110 and the housing 140 are movablein a direction perpendicular to the first direction. Although onesupport is disposed at each of the corner portions 142-1 to 142-4 of thehousing 140 in the embodiment shown in FIG. 5 , the disclosure is notlimited thereto.

In another embodiment, two or more supports may be disposed at onecorner portion of the housing 140.

Each of the plurality of supports 220-1 to 220-4 may be spaced apartfrom the housing 140, and may be directly connected to a correspondingone of the first couplers 510 of the first outer frame 152 of each ofthe upper springs 150-1 to 150-4.

In another embodiment, the supports 220 may be embodied as leaf springs,and may be disposed at the side portions 141-1 to 141-4 of the housing140.

The drive signal from the circuit board 250 may be transmitted to thefirst coil 120 through the plurality of supports 220-1 to 220-4 and theupper springs 150-1 to 150-4.

For example, the drive signal from the circuit board 250 may be appliedto the first coil 120 via the second and fourth springs 150-2 and 150-4and the second and fourth supports 220-2, 220-4.

The plurality of supports 220-1 to 220-4 may be additional membersseparated from the first elastic member 1150, and may be embodied asmembers having elastic supporting ability, for example, leaf springs,coil springs, suspension wires or the like. In another embodiment, thesupports 220-1 to 220-4 may be integrally formed with the first elasticmember 150.

Next, the base 210, the circuit board 250, the second coil 230 and theposition sensor 240 will be described.

The base 210 may have an opening corresponding to the opening in thebobbin 110 and/or the opening in the housing 140, and may be configuredto have a shape that coincides with or corresponds to the shape of thecover member 300, for example, a rectangular shape.

FIG. 6 is a perspective view of the second coil 230, the circuit board250 and the supports 220-1 to 220-4. FIG. 7 is an exploded perspectiveview of the circuit board 250 and the second coil 230, which aredisposed at the base 210. FIG. 8 is a fragmentary enlarged view of thebase 210 and the circuit board 250 shown in FIG. 7 . FIG. 9 is a bottomview of the circuit member including the second coil 230. FIG. 10A is anexploded perspective view of the base 210, the location sensor 240 andthe terminals 81 a to 81 d. FIG. 10B is a bottom view of the base 210.FIG. 10C is an assembled perspective view of the base 210 and theterminals 81 a to 81 d.

Referring to FIGS. 6 to 10 c, the base 210 may include a step 211, towhich an adhesive is applied when the cover member 300 is adhesivelyattached to the base 210. The step 211 may guide the cover member 300,which is coupled to the upper side thereof, and may face the lower endsof the side plates of the cover member 300.

The base 210 may be disposed under the bobbin 110 and the housing 140,and may include a support groove or a support portion 255 (see FIG.10A), which is formed on the side surface thereof that faces the portionincluding the terminals 251 of the circuit board 250. The supportportion 255 of the base 210 may support the terminal member 253 of thecircuit board 250.

The base 210 may be provided in the upper surface thereof with mountinggrooves 215-1 and 215-2, in which the position sensors 240 mounted onthe circuit board 250 are disposed or mounted. According to theembodiment, the base 210 may be provided with two mounting grooves 215-1and 215-2.

The second coil 230 may be disposed above the circuit board 250, and thebase 210 may be disposed under the circuit board 250.

For example, the position sensor 240 may be mounted on the lower surfaceof the circuit board 250, and the lower surface of the circuit board 250may face the upper surface of the base 210.

The circuit board 250 may be positioned under the housing 140, may bedisposed on the upper surface of the base 210, and may have an openingthat corresponds to the opening in the bobbin 110, the opening in thehousing 140 and/or the opening in the base 210.

The outer peripheral surface of the circuit board 250 may have a shapethat coincides with or corresponds to the upper surface of the base 210,for example, a square shape.

The circuit board 250 may include at least one terminal portion, whichis bent from the upper surface of the circuit board 250 and whichincludes a plurality of terminals 251 or pins for conductive connectionto external components.

The terminal portion 253 of the circuit board 250 may include theplurality of terminals 251. For example, a drive signal for driving thefirst coil 120, the second coil 230 and the location sensor 240 may bereceived through the plurality of terminals 251 provided at the terminalportion 253 of the circuit board 250.

According to the embodiment, the circuit board 250 may be an FPCBwithout being limited thereto.

The circuit board 250 may have holes 250 a, through which the supports220-1 to 220-4 extend. The holes 250 a may be disposed adjacent to thecorners of the circuit board 250.

The positions and the number of holes 250 a may correspond to orcoincide with the positions and the number of supports 220-1 to 220-4.

Each of the supports 220-1 to 220-4 may extend through a correspondingone of the holes 250 a in the circuit board 250 and may be disposed soas to be spaced apart from the inner surface of the hole 250 a. AlthoughFIG. 7 illustrates the holes 250 a through which the supports 220-1 to220-4 extend, the disclosure is not limited thereto. In anotherembodiment, the circuit board 250 may have openings, escape grooves orthe like, each of which has a shape that allows the supports 220-1 to220-4 to extend therethrough.

The second coil 230 may be positioned under the housing 140, and may bedisposed at the upper portion of the circuit board 250 so as tocorrespond to the magnets 130 disposed at the housing 140.

For example, the second coil 230 may include four OIS coils 230-1 to230-4 disposed at the four sides of the circuit board 250 without beinglimited thereto. The second coil 230 may also include only two coils,for example, one coil for the second direction and one coil for thethird direction, or may include four or more coils.

Although FIG. 7 illustrates the second coil 230 provided at anadditional circuit member 231 separate from the circuit board 250, thedisclosure is not limited thereto. In another embodiment, the secondcoil 230 may be embodied as a circuit pattern formed at the circuitboard 250.

In another embodiment, the circuit member 231 may be omitted, and thesecond coil 230 may be embodied as a ring-shaped coil block or an FPcoil separate from the circuit board 250.

Although the circuit board 250 and the circuit member 231 are describedas being separate components, the disclosure is not limited thereto. Inanother embodiment, a configuration including at least one of thecircuit board 250, the circuit member 231 and the second coil 230 may berepresented as the term “circuit member”.

The circuit member 231, at which the second coil 230 is provide, mayhave escape grooves 230 a formed in the corners thereof. The escapegrooves 230 a may have shapes such that the corners of the circuitmember 231 are chamfered. In another embodiment, the corner portions ofthe circuit member 231 may have holes through which the supports 220extend.

As described above, the housing 140 may be moved in the second directionand/or the third direction by the interaction between the magnets 130and the second coil 230, which correspond to each other, therebyperforming handshake correction.

The position sensor 240 may detect the intensity of the magnetic fieldof the magnets 130 disposed on the housing 140 when the housing 140 ismoved in a direction perpendicular to the optical-axis direction, andmay output an output signal (for example, an output voltage) accordingto the result of the detection.

Based on the output signal from the position sensor 240, it is possibleto detect displacement of the housing 140 relative to the base 210 in adirection (for example, in the X-axis direction or in the Y-axisdirection) perpendicular to the optical axis (for example, in the Z-axisdirection).

The position sensor 240 may include two OIS position sensors 240 a and240 b for detecting displacement of the housing 140 in the seconddirection (for example, in the X-axis direction) and in the thirddirection (for example, in the Y-axis direction) perpendicular to theoptical axis.

The OIS position sensor 240 a may detect the intensity of the magneticfield of the magnet 130 when the housing 140 is moved, and may output afirst output signal according to the result of the detection. The OISposition sensor 240 b may detect the intensity of the magnetic field ofthe magnet 130 when the housing 140 is moved, and may output a secondoutput signal according to the result of the detection. The controller830 of the camera module or the controller 780 of the portable terminal200A may detect the displacement of the housing 140 based on the firstand second output signals, and may perform OIS feedback operation basedon the detected displacement of the housing 140.

Each of the OIS position sensors 240 a and 240 b may be embodied as ahall sensor. Any sensor may be used, as long as the sensor is capable ofdetecting the intensity of a magnetic field. For example, each of theOIS position sensors 240 may be embodied as a driver including a hallsensor, or may be embodied as a position detection sensor, such as ahall sensor, alone.

Each of the OIS position sensors 240 a and 240 b may be mounted on thecircuit board 250, and the circuit board 250 may include terminalsconductively connected to the OIS position sensors 240 a and 240 b.

The opening in the base 210 may be provided therearound with aprojection 29, and the projection 29 may be fitted into the opening inthe circuit board 250 and the opening in the circuit member 231.

The projection 29 of the base 210 may be provided at the side surfacethereof with protrusions 29 a (see FIG. 12 ), which project in adirection perpendicular to the optical axis, and the opening in thecircuit board 250 may have grooves 250 b (see FIG. 13 ) corresponding tothe protrusions 29 a. The protrusions 29 a of the base 210 may beinserted into the grooves 250 b in the circuit board 250. By virtue ofthe coupling between the protrusions 29 a of the base 210 and thegrooves 250 b in the circuit board 250, it is possible to suppressrotation or movement of the circuit board 250 on the upper surface ofthe base 210.

Referring to FIG. 7 , the circuit board 250 may include a plurality ofpads 41 to 44 disposed on the upper surface thereof. Here, the term “padportion” in the pad portions of the circuit board 250 may be usedinterchangeably with “bonding portion”, “electrode portion”, “leadportion” or “terminal portion”.

For example, each of the plurality of pad portions 41 to 44 may bepositioned adjacent to a corresponding one of the holes 250 a in thecircuit board 250.

Each of the plurality of pad portions 41 to 44 may be positioned lowerthan the upper surface of the circuit board 250. For example, a depth d1in the optical-axis direction may be present between the upper surfacesof the plurality of pad portions 41 to 44 and the upper surface of thecircuit board 250. For example, the depth d1 may be 35 mm˜40 mm. Forexample, the depth d1 may be 37.5 mm.

The circuit board 250 may include exposed regions 14 a through which theplurality of pads 41 to 44 are exposed. The upper surfaces of theexposed regions 14 a may be positioned in the same plane as the uppersurface of the pad portion (for example, 41).

For example, the upper surfaces of the exposed regions 14 a may bepositioned lower than the upper surface of the circuit board 250, and adepth in the optical-axis direction may be present the upper surfaces ofthe exposed regions 14 a and the upper surface of the circuit board 250.

The exposed regions 14 a of the circuit board 250 may abut grooves 71 ato 71 d in the circuit board 250, and may be exposed or may open throughthe side surfaces or the grooves 71 a to 71 d in the circuit board 250.Since the exposed regions 14 a are exposed or opens through the sidesurfaces of the circuit board 250, solder may easily enter the padportions 41 to 44 of the circuit board 250 through the exposed regions14 a, thereby improving ease of soldering.

The circuit board 250 may have the plurality of grooves 71 a to 71 dformed in the side surface thereof. The grooves 71 a to 71 d in thecircuit board 250 may be intended to expose portions of the terminals 81a to 81 d mounted on the base 210, for example, portions (or exposedregions) 321 of the second couplers 320 (see FIG. 11 ).

Although each of the grooves 71 a to 71 d may take the form of a viahole or a recess formed in the side surface of the circuit board 250,the disclosure is not limited thereto. In another embodiment, the groovemay have the form of a through hole or a through via hole. Here, thethrough hole or the through via hole may be spaced apart from the sidesurface of the circuit board 250.

Referring to FIG. 9 , the circuit member 231 may include a plurality ofpad portions 35 a to 35 d disposed on the lower surface thereof so as tocorrespond to the plurality of the pad portions 41 to 44 of the circuitboard 250. The term “pad portion” used to refer to the pad portions 35 ato 35 of the circuit board 231 may be used interchangeably with “bondingportion”, “electrode portion”, “lead portion” or “terminal portion”.

Each of the pad portions 35 a to 35 d of the circuit board 231 may bepositioned so as to abut or to be adjacent to a corresponding one of theescape grooves 230 a in the circuit board 231.

Each of the pad portions 35 a to 25 d of the circuit board 231 may bepositioned higher than the lower surface of the circuit board 231. Forexample, a depth d2 in the optical-axis direction may be present betweenthe lower surfaces of the plurality of pad portions 35 a to 35 d and thelower surface of the circuit member 231. For example, the depth d2 maybe 35 mm˜40 mm. For example, the depth d2 may be 37.5 mm.

A portion of each of the pad portions 35 a to 35 d of the circuit boardmay overlap a corresponding one of the plurality of pad portions 41 to44 in the optical-axis direction. Another portion of each of the padportions 41 to 44 of the circuit board 250 that does not overlap acorresponding one of the pad portions 35 a to 35 d of the circuit board231 in the optical-axis direction may be exposed from the circuit board231 through the escape groove 230 a. The reason for this is to couplethe pad portions 41 to 44 to the pad portions 35 a to 35 d using solder.

By virtue of the depth d1 between the upper surfaces of the pad portions41 to 44 of the circuit board 250 and the upper surface of the circuitboard 250 and the depth d2 between the lower surfaces of the padportions 35 a to 35 d of the circuit board 231 and the lower surface ofthe circuit board 231, the distance or the space between the padportions 41 to 44 of the circuit board 250 and the pad portions 35 a to35 d of the circuit board 231 may be increased.

Consequently, solder may easily enter a space between the pad portions41 to 44 of the circuit board 250 and the pad portions 35 a to 35 d ofthe circuit board 231 and solderability may be improved when solderingthe pad portions 41 to 44 of the circuit board 250 to the pad portions35 a to 35 d of the circuit board 231.

Referring to FIG. 10A, the base 210 may include side portions 90 a to 90d and corner portions 91 a to 91 d.

For example, the base 210 may include a first side portion 90 a, asecond side portion 90 b, a third side portion 90 c, a fourth sideportion 90 d, a first corner portion 91 a between the first side portion90 a and the second side portion 90 b, a second corner portion 91 bbetween the second side portion 90 b and the third side portion 90 c, athird corner portion 91 c between the third side portion 90 c and thefourth side portion 90 d, and a fourth corner portions 91 d between thefourth side portion 90 d and the first side portion 90 a.

The side portions 90 a to 90 d of the base 210 may correspond to oroverlap the side portions 141-1 to 141-4 of the housing in theoptical-axis direction, and the corner portions 91 a to 91 d of the base210 may correspond to or overlap the corner portions 142-1 to 142-4 ofthe housing 140 in the optical-axis direction.

The corner portions 91 a to 91 d of the base 210 may have formed thereinholes 210 a, through which the supports 220-1 to 220-1 extend.

For example, each of the corner portions 91 a to 91 d of the base 210may have formed therein the hole 210 a, through which a correspondingone of the supports 220-1 to 220-4 extends. For example, the holes 210 amay be through holes, which are respectively formed through the cornerportion 91 a to 91 d.

Each of the corner portions 91 a to 91 d of the base 210 may be providedwith a stepped portion 26, in which a corresponding one of the terminals81 a to 81 d is mounted or inserted. The stepped portion 26 may have aform that is depressed from the lower surface of the base 210, and maybe referred to as a “groove portion”.

The stepped portions 26 of the base 210 may be provided at the lowerportions, the lower ends or the lower surfaces of the corner portions 91a to 91 d of the base 210, and at least one depth may be formed from thelower surface of the base 210 in a direction toward the upper surface 21b of the base from the lower surface 21 a of the base 210.

The stepped portion 26 of the base 210 may have a hole 210 a, throughwhich the support extends, and a hole 22 a, through which a portion ofeach of the terminals 91 a to 91 d is exposed through the upper surface21 b of the base 210.

For example, the stepped portion 26 of the base 210 may include a firstsurface 26 a, a second surface 26 b, a first side surface 27 a and asecond side surface 27 b.

For example, the first surface 26 a of the stepped portion 26 may have afirst depth T1 from the lower surface of the base 210 in a directiontoward the upper surface 21 b from the lower surface 21 a of the base21, and may be parallel to the lower surface 26 a of the base 210.

For example, the second surface 26 b of the stepped portion 26 may havea second depth T2 from the lower surface of the base 210 in a directiontoward the upper surface 21 b from the lower surface 21 a of the base210, and may be parallel to the lower surface 26 a of the base 210.

For example, the second depth T2 may be smaller than the first depth T1(T2<T1), and the second surface 26 b of the stepped portion 26 may bepositioned between the first surface 26 a and the lower surface 26 a ofthe base 210.

The first side surface 27 a of the stepped portion 26 may connect thefirst surface 26 a of the stepped portion 26 to the second surface 26 bof the stepped portion 26 and may be a sloping surface, which isinclined at a predetermined angle (for example, a right angle) withrespect to the first surface 26 a.

The second side surface 27 b of the stepped portion 26 may connect thelower surface 26 a of the base 210 to the second surface 26 b of thestepped portion 26, and may be a sloping surface, which is inclined at apredetermined angle (for example, a right angle) with respect to thesecond surface 26 b.

For example, the second surface 26 b and the second side surface 27 b ofthe stepped portion 26 may define a single groove, and the first surface26 a and the first side surface 27 a of the stepped portion 26 maydefine another groove.

The hole 210 a in the base 210 may be disposed or positioned at thefirst surface 26 a of the stepped portion 26.

The first surface 26 a of the base 210 may be provided with a protrusion28, which is coupled to a hole 311 in each of the terminals 81 a to 81d. The protrusion 28 may project from the first surface 26 a of the base210 in a direction toward the lower surface 21 a from the upper surface21 b of the base 210.

By virtue of the coupling between the protrusions 28 of the base 210 andthe holes 311 in the terminals 81 a to 91 d, it is possible to increasethe binding force between the terminals 81 a to 81 d and the base 210.

The base 210 may have a hole 22 a, which is disposed or positioned atthe second surface 26 b of the stepped portion 26. The hole 22 a may beformed through the upper surface 21 b of the base 210 and the secondsurface 26 b of the stepped portion 26, and a portion of each of theterminals 81 a to 81 d may be exposed or may open from the upper surface21 b of the base 210 through the hole 22 a.

Next, the terminals 81 a to 81 d will be described.

The terminals 81 a to 81 d may be disposed or mounted on the lowerportion, the lower end or the lower surface of the base 210. Althoughthe number of terminals may be equal to the number of supports, thedisclosure is not limited thereto. The terminals 81 a to 81 d may bereferred to as “terminal members” or “terminal units”.

For example, the embodiment may include the first to fourth terminals 81a to 81 d corresponding to the first to fourth supports 220-1 to 220-4.

For example, the first to fourth terminals 81 a to 81 d may be disposedat the four corners or the four corner portions of the base 210.

FIG. 11 illustrates a perspective view of the first terminal 81 a andthe first support 220-1.

The description regarding the first terminal 81 a shown in FIG. 11 maybe equally applied to the remaining terminals, that is, second and thirdterminals.

Referring to FIG. 11 , the first terminal 81 a may include a firstcoupler 310 and a second coupler 320. The first coupler 310 may bereferred to as a “first connector” or a “first portion”, and the secondcoupler 320 may be referred to as a “second connector” or a “secondportion”.

The second coupler 320 may be disposed between the base 210 and thecircuit board 250 k, and the first coupler 310 may be disposed lowerthan the second coupler 320.

For example, the second coupler 320 may be positioned lower than or atthe same height as the upper surface of the base 210.

The upper surface of the second coupler 320 may be exposed from theupper surface of the base 210, and the lower surface of the firstcoupler 310 may be exposed from the lower surface of the base 210.

The surface area of the first coupler 310 (for example, the surface areaof the upper surface thereof) may be larger than the surface area of thesecond coupler 320 (for example, the surface area of the upper surfacethereof).

For example, the length of the first coupler 310 in a direction towardthe second corner portion 91 b from the first corner portion 91 a of thebase 210 may be greater than the length of the second coupler in adirection toward the second corner portion 91 b from the first cornerportion 91 a.

The first coupler 310 may be positioned lower than the lower surface ofthe base 210 and may be positioned higher than a first holder 600 and asecond holder 800 of a camera module 200 (see FIG. 20 ).

The first terminal 81 a may include a connector 315 connecting the firstcoupler 310 to the second coupler 320. The connector 315 may be referredto as a “third connector” or a “third portion”.

The connector 315 may be bent or curved from the first coupler 310.Although the connector 315 may be integrally formed with the firstcoupler 310 and the second coupler 320, the disclosure is not limitedthereto. In another embodiment, the connector may be assembled with thebase 210 separately from the first coupler 310 and the second coupler320 and may be disposed at the side surface of the base 210.

The first coupler 310 may have a hole 305, through which the support(for example, 220-1) extends, and a hole 311, which is coupled to theprotrusion 28 of the stepped portion 26 of the base 210.

The hole 305 in the first coupler 310 may be a through hole. The hole305 in the first coupler 310 may correspond to the hole 210 a in thebase 210 and may overlap the hole 210 a in the base 210 in theoptical-axis direction or in a direction toward the upper surface 21 bfrom the lower surface 21 a of the base 210.

One end of the support (for example, 220-1) may be coupled to the firstcoupler 510 of the first outer frame 151 of the upper spring (forexample, 150-1).

The other end (for example, 81 a) of the support (for example, 220-1)may extend through the hole 305 in the terminal (for example, 81 a) andmay be coupled to the lower surface of the first coupler 310 usingsolder 902 (see FIG. 14 ).

For example, the lens moving apparatus 100 may further include thesolder 902 coupling the other end of the support (for example, 220-1),passing through the hole 305, to the lower surface of the first coupler310.

The hole 311 in the first coupler 310 may be coupled to the protrusion28 of the base 210 so as not only to increase the binding force betweenthe base 210 and the terminals 81 a to 81 d but also to improve thesolderability between the first coupler 310 and the supports.

Because heat generated during soldering is efficiently transmitted tothe outside of the first coupler 310 as the surface area of the firstcoupler 310 increase, there may be poor soldering between the support(for example, 220-1) and the hole 305 in the first coupler 310. The hole311 in the first coupler 310 may suppress the transmission of heatduring soldering and may thus improve solderability between the support(for example, 220-1) and the hole 305 in the first coupler 310.

The first coupler 310 may be disposed or positioned under the firstsurface 26 a of the stepped portion 26 of the base 210.

The second coupler 320 may be connected to one end of the first coupler310, and may be disposed or positioned under the second surface of thestepped portion 26 of the base 210.

A portion 321 of the second coupler 320 may be exposed from the uppersurface 21 b of the base 210 through the hole 22 a in the steppedportion 26. Hereinafter, the portion 321 of the second coupler 320 isreferred to as an exposed region 321 of the second coupler 320.

The first terminal 81 a may further include an extension 330 extendingfrom the other end of the first coupler 310.

The extension 330 may be parallel to the first coupler 310, may bepositioned in the same plane as the first coupler 310, and may beinserted into the base 210.

The extension 330 is capable of increasing the binding force between thefirst terminal 81 a and the base 210.

For example, the first coupler 310, the second coupler 320 and theextension 330 may be integrally formed with one another. For example,there may be a structure in which the terminals 81 a to 81 d may beinserted into the base 210 through insert injection molding.

For example, the terminals 81 a to 81 d may be formed in conjunctionwith the base 210 through insert injection molding, and at least aportion of each of the first coupler 310 and the second coupler 320 maybe inserted or disposed in the base 210.

For example, the terminals 81 a to 81 d may be formed in conjunctionwith the base 210 through insert injection molding, and the connector315 may be disposed in the base.

In another embodiment, the terminals may be attached or coupled to thelower surface or the upper surface of the base 210 rather than throughinsert injection molding.

FIG. 12 is a fragmentary perspective view of the base 210, the firstterminal 81 a and the circuit board 250, which are assembled with oneanother. FIG. 13 is a bottom view of the circuit board 250. FIG. 14illustrates solders 902 for coupling the terminals 81 a to 81 d to thesupports 220-1 to 220-4. FIG. 15 is a cross-sectional view of a padportion 257 of the circuit board 250. FIG. 16 is a cross-sectional viewof the lens moving apparatus 100 shown in FIG. 2 , taken along line A-B.

Referring to FIGS. 12 to 16 , the circuit board 250 may be disposed onthe upper surface of the base 210, and each of the grooves 71 a to 71 din the circuit board 250 may expose a corresponding one of the secondcouplers 320 of the terminals 81 a to 81 d exposed from the uppersurface 21 b of the base 210.

As illustrated in FIGS. 6 and 7 , each of the grooves 230 a in thecircuit board 231 may expose the upper surface of a corresponding one ofthe second couplers 320 of the terminals 81 a to 81 d exposed from theupper surface of the base 210.

The circuit board 250 may include the pad portions 257, each of which isdisposed at the upper portion, the lower portion and the side surfacebetween the upper portion and the lower portion.

The number of pad portions 257 may be plural. The pad portions may bedisposed so as to correspond to the terminals 81 a to 81 d, or may bedisposed at positions corresponding to the terminals 81 a to 81 d. Forexample, the four pad portions 247 corresponding to the terminals 81 ato 81 d may be disposed at the four corners or the corner portions ofthe circuit board 250, without being limited thereto.

In another embodiment, the pad portions may be disposed only at twocorners or two corner portions of the circuit board 250, and may beconductively connected to the two terminals 251 of the circuit board 250in order to provide a drive signal to the first coil. For example, thetwo corners, at which the pad portions are disposed, may be corners thatare positioned in a diagonal direction of the circuit board, or twocorners included on a single side of the circuit board.

In a further embodiment, four pad portions may be disposed at fourcorners or four corner portions of the circuit board 250, and the padportions disposed at two corners may be soldered to the terminals (forexample, 81 a and 81 b) and may be conductively connected to twoterminals 251 of the circuit board 250. The pad portions that aredisposed at the remaining two corners may be soldered to the terminals(for example, 81 a and 81 b) but may not be conductively connected tothe terminals 251 of the circuit board 250. The reason for this is toprevent the occurrence of problems such as mechanical tilting of thelens moving apparatus when all four pad portions are soldered to theterminals.

The pad portions 257 may be Au-plated layers or copper-plated layersincluding Au.

For example, the pad portions 257 may be respectively provided at thegrooves 71 a to 71 d in the circuit board 250. Although FIG. 12illustrates only the pad portion provided in the groove 71 a, thedescription regarding the pad portion shown in FIG. 12 may be equallyapplied to the pad portions proved in the other grooves 71 b to 71 d.

The pad portion 257 of the circuit board 257 may be disposed at theupper surface of the circuit board 250, the lower surface of the circuitboard 250 and the side surface connecting the upper surface to the lowersurface of the circuit board 250.

For example, the pad portion 257 may be disposed at the side surface ofthe groove (for example, 71 a), the upper surface of the circuit board250 abutting the side surface of the groove (for example, 71 a) and thelower surface of the circuit board 250 abutting the side surface of thegroove (for example, 71 a).

For example, the pad portion 257 of the circuit board 250 may include afirst pad 259 b disposed at the lower portion of the circuit board 250abutting the side surface of the groove 71 a, a second pad 259 bdisposed at the upper portion of the circuit board 250 abutting the sidesurface of the groove 71 a, and a third pad 605 disposed at the sidesurface of the groove 71 a so as to connect the first pad 259 b to thesecond pad 259 a.

The third pad 605 may be disposed at the side surface of the circuitboard 250.

The side surface of each of the grooves 71 a to 71 d in the circuitboard 250 may have formed therein a via or a groove, and a portion (forexample, the third pad 605) of the pad portion 257 may be disposed inthe via or the groove.

The third pad 605 of the pad portion 257 of the circuit board 250 mayhave a form depressed from the side surface of the groove 71 a, forexample, the form of a semicircular via.

The radius of the via may be, for example, 0.1 mm˜0.5 mm, without beinglimited thereto. For example, the radius of the via may be 0.2 mm˜0.3mm. For example, the radius of the via may be 0.2 mm

When the radius of the via is smaller than 0.1 mm, improvement inbonding force and solderability between the pad portion 257 of thecircuit board 250 and the terminal may be insufficient. When the radiusof the via is larger than 0.5 mm, the pad portion 257 may be enlargedmore than necessary, relative to the second coupler 320 of each of theterminals 81 a to 81 d, thereby increasing the manufacturing costs andlowering freedom in design of the pattern of the circuit board 250.

The first pad 259 b of the pad portion 257 of the circuit board 250 mayface the terminal (for example, 81 a) in the optical-axis direction.

The first pad 259 b of the pad portion 257 of the circuit board 250 mayabut the exposed region 321 of the second coupler 320 of the firstterminal 81 a.

Referring to FIG. 15 , the circuit board 250 may include a firstinsulation layer 601, a first conductive layer 602 a disposed on theupper surface of the insulation layer 601, a second insulation layer 603a disposed on the upper surface of the first conductive layer 602 a, asecond conductive layer 602 b disposed on the lower surface of the firstinsulation layer 601, and a third insulation layer 603 a disposed on thelower surface of the second conductive layer 602 b.

For example, a first adhesive layer may be disposed between the firstinsulation layer 601 and the first conductive layer 602 a, and a secondadhesive layer may be disposed between the third insulation layer 603 aand the second conductive layer 602 b.

The first conductive layer 602 a may be a patterned metal layer, forexample, a Cu-plated layer.

The second conductive layer 602 b may be a metal layer (for example, aCu layer) or a patterned metal layer.

For example, the first conductive layer 602 a may be patterned so as toinclude wires and pads, which are conductively connected to the supports220-1 to 220-4, the second coil 230 and the second position sensor 240.

The first to third insulation layers 601, 603 a and 603 b may be made ofresin, for example, polyimide, without being limited thereto.

The first pad 259 b may be disposed on the lower surface of the secondconductive layer 602 b, and the second pad 259 a may be disposed on theupper surface of the first conductive layer 602 a.

For example, the lower surface of the first pad 259 b may be positionedhigher than the lower surface of the third insulation layer 603 b.

For example, each of the second pad 259 a of the pad portion 257 may beconductively connected to a corresponding one of the terminals 251 ofthe circuit board 250 via the first patterned conductive layer 602 a.

The upper surface of the first conductive layer 602 a may include aregion 59 a, which is exposed from the second insulation layer 603 a soas to be brought into contact with the second pad 259 a, and the lowersurface of the second conductive layer 602 b may include a region 59 b,which is exposed from the third insulation layer 603 b so as to bebrought into contact with the first pad 259 b.

For example, the first pad 259 b may be disposed at the exposed region59 b of the lower surface of the second conductive layer 602 b, and thesecond pad 259 a may be disposed at the exposed region 59 a of the uppersurface of the first conductive layer 602 a.

For example, the surface area of the first pad 259 b that is in contactwith the exposed region 59 b of the lower surface of the secondconductive layer 602 b may be larger than the surface area of the secondpad 259 a that is in contact with the exposed region 59 a of the uppersurface of the first conductive layer 602 a.

The exposed region 14 a of the circuit board 250 may be a portion of thefirst patterned conductive layer 602 a exposed from the secondinsulation layer 603 a, and the upper surface of the exposed region 14 amay be the upper surface of the first patterned conductive layer 602 a.

Each of the pad portions 41 to 44 of the circuit board 250 and acorresponding one of the pad portions 257 may be spaced apart from eachother, may be conductively isolated from each other and may bepositioned in the exposed region 14 a.

For example, a depth toward the upper surface from the lower surface ofthe circuit board 250 may be present between the lower surface of thefirst pad 259 b of the circuit board 250 and the lower surface of thethird insulation layer 603 b or between the lower surface of the firstpad 259 b and the exposed region 321 of the second coupler 320, and thedepth may be 25.5 mm˜27.5 mm.

The third pad 605 of the pad portion 257 may be disposed on the sidesurface of the first insulation layer 601, may connect the second pad259 a of the pad portion 257 to the first pad 259 b, and may be a platedlayer. For example, the thickness of each of the first pad 259 b, thesecond pad 259 a and the third pad 605 of the pad portion 257 may be 10mm˜12 mm.

Although the third pad 605 of the pad portion 257 may be, for example,an Au-plated layer, the disclosure is not limited thereto.

By means of a conductive adhesive member or solder, the exposed region321 of the second coupler 320 of each of the terminals 81 a to 81 d andthe pad portion 257 of the circuit board 257 may be coupled to eachother and may be conductively connected to each other.

Although the surface area of the first pad 259 b of the pad portion 257of the circuit board 250 may be larger than the surface area of thesecond pad 259 a, the disclosure is not limited thereto.

Referring to FIG. 16 , the ratio (H3/H1) of the first distance H3 to thesecond distance H1 may be 1.18˜1.2, and the ratio (H3/H) of the firstdistance H3 to the third distance H may be 1.16˜1.17. For example, theratio (H3/H) may be 1.1667, and the ratio (H3/H1) may be 1.188.

The first distance H3 may be the distance between the lower surfaces ofthe upper springs 150-1 to 150-4 and the lower surfaces of the firstcouplers 310 of the terminals 81 a to 81 d. The second distance H1 maybe the distance between the lower surfaces of the upper springs 150-1 to150-4 and the lower surface of the circuit member 231. The thirddistance H may be the distance between the lower surfaces of the uppersprings 150-1 to 150-4 and the lower surface of the circuit board 250.

Generally, as the thickness of a cellular phone is decreased, the heightof a camera module is also decreased. Furthermore, as the height of thecamera module is decreased, the length of the OIS wire (for example, theabove-mentioned support 220-1 to 220-4) of the lens moving apparatus isdecreased, and thus power consumption may be increased due to thedecreased length of the OIS wire. Decreasing the diameter of the OISwire in order to prevent the increase in power consumption and theconsequent deterioration in reliability entails concerns aboutdisconnection of the OIS wire and deterioration in reliability of OISdriving.

According to the embodiment, since the supports 220-1 to 220-4 arecoupled to the lower surfaces of the terminals 81 a to 81 d positionedunder the circuit board 250, it is possible to increase the length ofthe supports 220-1 to 220-4. Consequently, it is possible to reducepower consumption by reducing the intensity of current flowing throughthe supports 220-1 to 220-4 and to prevent deterioration in reliabilityof OIS driving attributable to the decreased diameter of the supports220-1 to 220-4.

When the ratio (H3/H1) is smaller than 1.18 or the ratio (H3/H) is lessthan 1.16, the increase in the length of the supports 220-1 to 220-4 maybe insufficient, thereby making it impossible to obtain an effect ofreducing power consumption and making it impossible to preventdeterioration in reliability of OIS operation attributable to thereduced diameter of the supports 220-1 to 220-4.

Meanwhile, when the ratio (H3/H1) is greater than 1.2 or the ratio(H3/H) is greater than 1.17, the thickness of the lens moving apparatusmay be increased.

The distance H2 between the lower surfaces of the upper springs 150-1 to150-4 and the upper surface of the circuit member 231 may be 1.86 mm.

For example, the height (or the thickness in the optical-axis direction)of the housing 140 may be 1.3 mm˜2 mm. For example, the height (or thethickness in the optical-axis direction) of the housing 140 may be 1.4mm˜1.6 mm. For example, the height (or the thickness in the optical-axisdirection) of the housing 140 may be 1.51 mm.

FIG. 17A illustrates the coupling between the circuit board 25 a and theterminal 8 a by means of the solder 86. FIG. 17B illustrates thecoupling between the pad portion 257 of the circuit board 250 and theterminal 81 a according to the embodiment.

Referring to FIG. 17A, the circuit board 25 a may include a pad portion58 disposed only at the lower surface thereof. When the pad portion 58is disposed only at the lower surface of the circuit board 25 a, thespace between the lower surface of the circuit board 25 a and theterminal 8 a may be reduced. Hence, the solder may not easily enter aspace between the circuit board 25 a and the terminal 8 a, therebydeteriorating solderability during soldering, and thus electricaldisconnection between the terminal 8 a and the circuit board 250 mayoccur.

Referring to FIG. 17B, the lens moving apparatus 100 according to theembodiment may include a conductive adhesive member or solder 410 forcoupling the terminals 81 a to 81 d to the pad portions of the circuitboard 250.

The solder 410 may be disposed between the second coupler 320 (forexample, the exposed region 321) and the first pad 259 b of the padportion 257 of the circuit board 250. Furthermore, the solder 410 may bedisposed on the second pad 259 a and the third pad 605.

For example, the solder 410 may be disposed between the first to thirdpads 259 b, 259 a and 605 of the circuit board 250 and the secondcoupler 320 (for example, the exposed region 321).

Since the pad portion 257 according to the embodiment includes the firstpad 259 b disposed at the lower portion of the circuit board 250, thethird pad 605 provided at the side surface of each of the grooves 71 ato 71 d in the circuit board 250 and the second pad 259 a disposed atthe upper portion of the circuit board 250, the solder may be bonded tothe third pad 605 and the second pad 259 a of the circuit board 250during soldering. Hence, the surface tension of the solder may beincreased, and thus infiltrating force with which the solder infiltratesbetween the first pad 259 b of the circuit board 250 and the exposedregion 231 of each of the terminals 81 a to 81 d may be increased. As aresult, it is possible to improve the ease of soldering of the padportions 257 of the circuit board 250 to the terminals 81 a to 81 d andto increase the binding force therebetween, and thus it is possible toprevent electrical disconnection of the terminals from the circuitboard.

Furthermore, since the third pad 605 of the circuit board 250 has acurved shape, the contact area thereof may be increased. Consequently,it is possible to improve ease of soldering and the binding forcebetween the pad portions 257 of the circuit board 250 and the terminals81 a to 81 d.

Although the embodiment shown FIGS. 1 to 17 does not includes an AFlocation sensor for AF feedback operation, the disclosure is not limitedthereto. Another embodiment may include an AF location sensor for AFfeedback operation. In this case, the AF location sensor may bepositioned at the bobbin 110.

A further embodiment may further include an AF location sensor and asensing magnet. In this case, the AF location sensor may be disposed atone of the housing and the bobbin, and the sensing magnet may bedisposed at the other of the housing and the bobbin.

When the lens moving apparatus according to the embodiment include theAF location sensor, the embodiment may include a sufficient number ofupper springs and supports in order to conductively connect the AFlocation sensor to the circuit board. Alternatively, the second elasticmember may include a plurality of lower springs, and the AF locationsensor and the circuit board may be conductively connected to each othervia the upper springs and the lower springs.

FIG. 18A is a perspective view of a first terminal 1081 a and firstsupport 220-1 according to another embodiment. FIG. 18B is a perspectiveview of the first terminal of FIG. 18A.

The first terminal 1081 a shown in FIGS. 18A and 18B is anotherembodiment or a modification of the first terminal 81 a shown in FIG. 11.

The description regarding the first terminal 1081 a shown in FIGS. 18Aand 18B may be equally applied to the remaining second to fourthterminals 1081 b to 1081 d.

Referring to FIGS. 18A and 18B, the first terminal 1081 a may include afirst coupler 1310, a second coupler 320 and a connector 1315. The firstcoupler 1310 may be referred to as a “first connector” or a “firstportion”, the second coupler 320 may be referred to as a “secondconnector” or a “second portion”, and the connector 1315 may be referredto as a “third connector” or a “third portion”.

For example, the connector 1315 may connect a portion of one sidesurface (hereinafter, referred to as a “first side surface 20 a”) of thefirst coupler 1310 to a portion of one side surface (hereinafter,referred to as a “first side surface 20 b”) of the second coupler 320.

The connector 1315 may include a curved portion, a bent portion and/or abent portion.

Although the connector 1315 may have, for example, a shape that is bentor curved from the first coupler 1310, the disclosure is not limitedthereto. In another embodiment, the connector may have the form of alinear or planar plate.

Since the connector 1315 has a curved portion or a bent portion, it ispossible to increase the length of the connector 1315 and to improve aneffect of suppressing heat transmission through the connector 1315.

The connector 1315 may project or extend from the first side surface 20a of the first coupler 1310, and may project or extend from the firstside surface 20 b of the second coupler 320.

For example, one end of the connector 1315 may project or extend from aportion of the first side surface 20 a of the first coupler 1310, andthe other end of the connector 1315 may project or extend from a portionof the first side surface 20 b of the second coupler 320.

For example, the ratio of the cross-sectional area (for example, 0.01[mm²]) of the connector 1315 to the surface area of the first sidesurface 20 a of the first coupler 1310 in the optical-axis direction maybe 1:5˜1:8.

For example, the ratio of the cross-sectional area of the connector 1315to the surface area of the first side surface 20 b of the second coupler320 in the optical-axis direction may be 1:4˜1:6.

Although the connector 1315 may be integrally formed with the firstconnector 1310 and the second coupler 320, the disclosure is not limitedthereto. In another embodiment, the connector may be prepared separatelyfrom the first coupler 1310 and the second coupler 320, may be assembledwith the base 210, and may be disposed at the side surface of the base210.

The second coupler 320 may be disposed between the base 210 and thecircuit board 250, and the first coupler 1310 may be disposed lower thanthe second coupler 320. The connector 1315 may connect the first coupler1310 to the second coupler 320 in an inclined direction toward thesecond coupler 320 from the first coupler 1310.

The upper surface of the second coupler 320 may be exposed from theupper surface of the base 210, and the lower surface of the firstcoupler 1310 may be exposed from the lower surface of the base 210.

Although the second coupler 320 may have the form of a rectangularparallelepiped plate in FIG. 18B, the disclosure is not limited thereto.For example, the upper surface of the second coupler 320 may have apolygonal shape such as a rectangular shape, a circular shape, anelliptical shape, a semicircular shape, a semielliptical shape or asector shape, without being limited thereto.

The first side surface 20 a of the first coupler 1310 may have formedtherein a groove, which is coupled to the protrusion provided at thefirst side surface 27 a of the stepped portion 26 of the base 210.Consequently, it is possible to increase the binding force between thefirst coupler 1310 and the base 210.

For example, the upper surface of the second coupler 320 may have ashape that extends from the connector 1315 and gradually increases inarea with increasing distance from the connector 1315.

The surface area of the first coupler 1310 (for example, the surfacearea of the upper surface thereof) may be larger than the surface areaof the second coupler 320 (for example, the surface area of the uppersurface thereof).

For example, the surface area of the upper surface of the second coupler320 may be larger than the surface area of the upper surface of theconnector 1315.

The length M4 (see FIG. 18B) of the first coupler 1310 in a firsthorizontal direction may be greater than the horizontal length M2 of thesecond coupler 320 in the first horizontal direction (M4>M2).

For example, the first horizontal direction may be a direction parallelto the first side surface of the first coupler 1310 or the first sidesurface of the second coupler 320.

Alternatively, the first horizontal direction may be the longitudinaldirection of the upper surface of the first coupler 1310 or thelongitudinal direction of the upper surface of the second coupler 320.

Alternatively, the first horizontal direction may be a direction towardthe fourth corner portion 91 d from the first corner portion 91 a of thebase 210.

For example, the length M3 (see FIG. 18B) of the first coupler 1310 in asecond horizontal direction may be greater than the length M1 of thesecond coupler 320 in the second horizontal direction (M3>M1).

For example, the second horizontal direction may be a directionperpendicular to the first horizontal direction or a direction towardthe second corner portion 91 b from the first corner portion 91 a of thebase 210.

The second horizontal direction may be a direction toward a secondimaginary plane, which is the same plane as the first side surface ofthe second coupler 320, from a first imaginary plane, which is the sameplane as the first side surface of the first coupler 1310 and isperpendicular to the first imaginary plane and the second imaginaryplane.

The first coupler 1310 may be positioned lower than the lower surface ofthe base 210 but higher than the first holder 600 and the second holder800 of the camera module 200 (see FIG. 18 ).

The width K2 of the connector 1315 may be less than the length M5 of thefirst side surface 20 a of the first coupler 1310 in the firsthorizontal direction and the length M2 of the first side surface 20 b ofthe second coupler 320 in the first horizontal direction (K2<M5, M2).

The horizontal distance K1 between the first coupler 1310 and the secondcoupler 320 in the second horizontal direction may be less than thelength M1 of the second coupler 320 in the second horizontal direction(K1<M1).

For example, the horizontal distance K1 may be the shortest distancebetween the first imaginary plane, which is the same plane as the firstside surface of the first coupler 1310, and the second imaginary plane,which is the same plane as the first side surface of the second coupler320.

The length of the connector 1315 may be less than the length M1 of thesecond coupler 320 in the second horizontal direction.

For example, the length of the connector 1315 may be the shortestdistance between the first side surface of the first coupler 1310 andthe first side surface of the second coupler 320.

For example, the length of the connector 1315 may also be the shortestdistance between the first coupling region 1315 a of the connector 1315connected to the first side surface of the first coupler 1310 and thesecond coupling region 1315 b of the connector 1315 connected to thefirst side surface of the second coupler 310.

For example, the length of the connector 1315 may also be the distancebetween the first coupler 1310 and the second coupler 320.

The surface area of the connector 1315 (for example, the surface area ofthe upper surface thereof) may be smaller than the surface area of thesecond coupler 320 (for example, the surface area of the upper surfacethereof).

For soldering between the second coupler 320 and the pad portion 257 ofthe circuit board 250, heat is supplied to the second coupler 320 bymeans of a heating blower, and the heat supplied to the second coupler320 may be transmitted to the first coupler 1310 via the connector 1315.

Here, because the surface area of the first coupler 1310 is larger thanthe surface area of the second coupler 320, the amount of heattransmitted to the first coupler 1310 may be increased. Hence, becausethe solder is not sufficiently melted and thus the solder is notefficiently transmitted to the space (or the gap) between the padportion 257 or the circuit board 250 and the second coupler 320, poorsoldering between the second coupler 320 and the pad portion 257, forexample, cold soldering may occur.

According to the embodiment, since the width K2 of the connector 1315,which is a connecting path connecting the first coupler 1310 to thesecond coupler 320, is decreased in order to maximize the melting pointof lead or solder, it is possible to suppress transmission of heat tothe first coupler 1310 from the second coupler 320 and to allow thesolder to be easily melted in a short period of time. Consequently, itis possible to prevent poor soldering, for example, cold solderingbetween the second coupler 320 and the pad portion 257, and to ensurereliability in soldering.

The length M3 of the first coupler 1310 may be 1 [mm]˜2 [mm].

For example, the length M3 of the first coupler 1310 may be 1.12 [mm].

The length M4 of the first coupler 1310 may be 1 [mm]˜2 [mm].

For example, the length M4 of the first coupler 1310 may be 1.17 [mm].

The length M1 of the second coupler 320 may be 0.3 [mm]˜0.5 [mm].

For example, the length M1 of the second coupler 320 may be 0.39 [mm].

The length M2 of the second coupler 320 may be 0.3 [mm]˜0.5 [mm].

For example, the length M2 of the second coupler 320 may be 0.45 [mm].

For example, the length M2 of the second coupler 320 may be greater thanthe length M1 of the second coupler 310, without being limited thereto.In another embodiment, the length M2 of the second coupler 320 may beequal to or less than the length M1 of the second coupler 310.

The horizontal distance K1 between the first coupler 1310 and the secondcoupler 320 may be 0.15 [mm]˜0.25 [mm]. For example, the horizontaldistance K1 may be 0.22 [mm].

For example, the vertical distance VL between the first coupler 1310 andthe second coupler 320 may be 0.03 [mm]˜0.07 [mm]. For example, thehorizontal distance VL may be the shortest distance between a thirdimaginary plane, which is the same plane as the upper surface of thefirst coupler 1310 and a fourth imaginary plane, which is the same planeas the lower surface of the second coupler 310.

The vertical distance VL may be less than the width K2 of the connector1315 (VL<K2). In another embodiment, the vertical distance VL may beequal to the width K2 of the connector 1315.

When the horizontal distance K1 is less than, for example, 0.15 [mm],the length of the connector 1315 may be decreased and the effect ofsuppressing heat transmission may be reduced, thereby making itimpossible to prevent cold soldering. When the vertical distance K1 isgreater than 0.25 [mm], the length of the connector 1315 may beincreased and the durability thereof may be lowered, thereby causing theconnector 1315 to be cut.

Furthermore, when the vertical distance VL is less than 0.03 [mm], theeffect of increasing the length of the connector by virtue of the bentportion may be insufficient, and thus an effect of suppressing heattransmission is lowered, thereby making it impossible to prevent coldsoldering.

When the vertical distance VL is greater than, for example, 0.07 [mm],the length of the connector 1315 may be increased and the durabilitythereof may be lowered, thereby causing the connector 1315 to be cut.

The width K2 of the connector 1315 may be 0.05 [mm]˜0.2 [mm].

For example, the width K2 of the connector 1315 may be 0.1 [mm].

When the width K2 of the connector 1315 is less than 0.05 [mm], thedurability of the connector 1315 may be lowered, thereby causingelectrical disconnection. When the width K2 of the connector 1315 isgreater than 0.2 [mm], the effect of suppressing heat transmission maybe lowered, thereby causing the connector 1315 to be cut and thuscausing electrical disconnection. When the width K2 of the connector1315 is greater than 0.2 [mm], the effect of suppressing heattransmission may be lowered, thereby making it impossible to preventcold soldering.

The thickness T11 of the first coupler 1310 may be 0.08 [mm].

The thickness of the second coupler 320 may be equal to the thicknessT11 of the first coupler 1310.

The thickness T12 of the connector 1315 may be 0.08 [mm].

Although the thickness T12 of the connector 1315 may be equal to thethickness T11 of the first coupler 1310, the disclosure is not limitedthereto. In another embodiment, the thickness of the connector 1315 maybe less than the thickness of the first coupler 1310.

For example, the ratio (A1:A2) of the surface area A1 of the uppersurface of the second coupler 310 to the surface area A2 of the uppersurface of the first coupler 1310 may be 1:4˜1:40.

For example, the ratio (A3:A1) of the surface area A3 of the uppersurface of the connector 1315 to the surface area A1 of the uppersurface of the second coupler 320 may be 1:9˜1:30.

When the value (A1/A3) obtained by dividing the surface area A1 of theupper surface of the second coupler 320 by the surface area A3 of theupper surface of the connector 1315 is less than 9, an effect ofsuppressing heat transmission may be lowered, thereby making itimpossible to prevent cold soldering.

On the other hand, when the value (A1/A3) obtained by dividing thesurface area A1 of the upper surface of the second coupler 320 by thesurface area A3 of the upper surface of the connector 1315 is less than30, the durability of the connector 1315 may be lowered, thereby causingthe connector 1315 to be cut and causing electrical disconnection.

The ratio (K2:M2) of the width K2 of the connector 1315 to the length M2of the second coupler 320 may be 1:1.5˜1:10.

When the value (M2/K2) obtained by dividing the length M2 of the secondcoupler 320 by the width K2 of the connector 1315 is less than 1.5, aneffect of suppressing heat transmission may be lowered, thereby makingit impossible to prevent cold soldering.

When the value (M2/K2) obtained by dividing the length M2 of the secondcoupler 320 by the width K2 of the connector 1315 is less than 10, thedurability of the connector 1315 may be lowered, thereby causing theconnector 1315 to be cut and causing electrical disconnection.

The first coupler 1310 may have therein the hole 305, through which thesupport (for example, 220-1) extends.

For example, the hole 305 in the first coupler 1310 may be a throughhole.

The diameter R1 of the hole 305 may be 0.2 [mm]˜0.4 [mm]. For example,the diameter R1 of the hole 305 may be 0.3 [mm].

The diameter R1 of the hole 305 may be larger than the width K2 of theconnector 1315. In another embodiment, the diameter R1 of the hole 305may be equal to the width K2 of the connector 1315.

The diameter or the thickness of each of the supports 220-1 to 220-4 maybe smaller than the width of the connector 1315.

For example, the diameter or the thickness of each of the supports 220-1to 220-4 may be 30 [μm]˜70 [μm]. For example, the diameter or thethickness of each of the supports 220-1 to 220-6 may be 36[μm]˜50 [μm].

The hole 305 in the first coupler 1310 may correspond to the hole 210 ain the base 210, and may overlap the hole 210 a in the base 210 in theoptical-axis direction or in a direction toward the upper surface 21 bfrom the lower surface 21 a of the base 210.

One end of the support (for example, 220-1) may be coupled to the firstcoupler 510 of the first outer frame 151 of the upper spring (forexample, 150-1).

The other end of the support (for example, 220-1) may extend through thehole 305 in the terminal (for example, 1081 a) and may be coupled to thelower surface of the first coupler 1310 using the solder 902 (see FIG.14 ).

For example, the lens moving apparatus 100 may further include thesolder 902 coupling the other end of the support (for example, 220-1),having passed through hole 305, to the lower surface of the firstcoupler 1310.

The first coupler 1310 may be disposed or positioned under the firstsurface 26 a of the stepped portion 26 of the base 210.

The second coupler 320 may be connected to one end of the first coupler1310, and may be disposed or positioned under the second surface of thestepped portion 26 of the base 210.

A portion 321 of the second coupler 320 may be exposed from the uppersurface 21 b of the base 210 through the hole 22 a in the steppedportion 26. Hereinafter, the portion 321 of the second coupler 320 isreferred to as an exposed region 321 of the second coupler 320.

The first terminal 1081 a may further include the extension 330extending from another end of the first coupler 1310.

The extension 330 may be parallel to the first coupler 1310, may bepositioned in the same plane as the first coupler 1310, and may beinserted into the base 210.

The extension 330 may increase the binding force between the firstterminal 1081 a and the base 210.

For example, the length Q1 of the extension 330 in the second horizontaldirection may be 0.2 [mm]˜0.8 [mm]. For example, the length Q1 of theextension 330 may be 0.5 [mm].

For example, the first coupler 1310, the second coupler 320 and theextension 330 may be integrally formed with one another. For example,the terminals 1081 a to 1081 d may be inserted into the base 210 throughinsert injection molding.

For example, the terminals 1081 a to 1081 d may be formed in conjunctionwith the base 210 through insert injection molding, and at least aportion of each of the first coupler 1310 and the second coupler 320 maybe inserted into or disposed at the base 210.

For example, the terminals 1081 a to 1081 d may be insert injectionmolded in conjunction with the base 210, and the connector 1315 may bedisposed in the base.

In another embodiment, the terminals may be attached or coupled to thelower surface of the upper surface of the base 210 rather than beinginsert injection molded in conjunction with the base.

FIG. 18C is a perspective view of a first terminal 1081 a-1 and a firstsupport 220-1 according to another embodiment. The description regardingthe first terminal 1081 a-1 shown in FIG. 18C may be equally applied tothe remaining second to fourth terminals.

Referring to FIG. 18C, the first coupler 1310 may further include a hole311, which is coupled to the protrusion 28 of the stepped portion 26 ofthe base 210. The hole 311 in the first coupler 1310 may be coupled tothe protrusion 28 of the base 210, thereby increasing the binding forcebetween the base 210 and the terminals 1081 a to 1081 d and improvingthe solderability between the first coupler 1310 and the supports.

Because heat generated during soldering is efficiently transmitted tothe outside of the first coupler 1310 as the surface area of the firstcoupler 1310 increases, ease of soldering between the support (forexample, 220-1) and the hole 305 in the first coupler 1310 may be poor.The hole 311 in the first coupler 1310 may suppress the transmission ofheat during soldering and may thus improve the solderability between thesupport (for example, 220-1) and the hole 305 in the first coupler 1310.

Furthermore, by virtue of the coupling between the hole 311 in the firstcoupler 1310 and the protrusion 28 of the base 210, it is possible toincrease the binding force between the base 210 and the first terminals1081 a.

FIGS. 19A to 19E illustrate connectors 1315-1 to 1315-5 of the firstterminal 1091 a-1 according to a further embodiment.

The first terminals shown in FIGS. 19A to 19E may include examples ofthe connector having different widths and may be modifications of thefirst terminal 81 a, 1081 a. The description regarding the firstterminal 1081 a-1 may be equally applied to the remaining second tofourth terminals.

Referring to FIG. 19A, the width K21 of a connector 1315-1 may increasetoward the second coupling region of the connector 1315-1 connected tothe second coupler 320 from the first coupling region of the connector1315-1 connected to the first coupler 1310.

For example, the width of the first coupling region of the connector1315-1 may be less than the width of the second coupling region of theconnector 1315-1.

Referring to FIG. 19B, the width K22 of a connector 1315-2 may decreasetoward the second coupling region of the connector 1315-1 connected tothe second coupler 320 from the first coupling region of the connector1315-1 connected to the first coupler 1310.

For example, the width of the first coupling region of the connector1315-1 may be greater than the width of the second coupling region ofthe connector 1315-1.

Referring to FIG. 19C, the width of a connector 1315-3 may decrease andthen increase toward the second coupling region from the first couplingregion.

Each of widths of two opposite ends of the connector 1315-3 may begreater than the width of the central portion of the connector 1315-3.

Referring to FIG. 19D, the first coupling region (or one end) of aconnector 1315-4 may be connected to a portion of the first side surfaceof the first coupler 1310, and the second coupling region (or the otherend) of the connector 1315-4 may be connected to the entire first sidesurface of the second coupler 320.

For example, the width K24 of the connector 1315-4 may increase towardthe second coupling region from the first coupling region of theconnector 1315-4.

Referring to FIG. 19E, the first coupling region (or one end) of aconnector 1315-5 may be connected to the entire first side surface ofthe first coupler 1310, and the second coupling (or the other end) ofthe connector 1315-5 may be connected to the entire first side surfaceof the second coupler 320.

For example, the width K25 of the connector 1315-5 may decrease towardthe second coupling region from the first coupling region of theconnector 1315-5.

In FIGS. 19A to 19E, each of the connectors 1315-1 to 1315-5 may have alinear shape, the width of which increases linearly, or a curved shape,the width of which increases non-linearly.

For example, each of the two side surfaces of each of the connectors1315-1 to 1315-5 may be a planar surface or a curved surface (forexample, a concave surface or a convex surface).

The description regarding the first terminal 81 a shown in FIGS. 12 to17B may be equally applied to the first terminal according to otherembodiments shown in FIGS. 18A to 19E.

Meanwhile, the lens moving apparatuses according to the above-describedembodiments may be used in various fields, such as, for example, thoseof a camera module or an optical device.

For example, the lens moving apparatus 100 according to the embodimentmay be included in an optical instrument, which is designed to form theimage of an object in a space using reflexion, refraction, absorption,interference, diffraction or the like, which is the characteristic oflight, to extend eyesight, to record an image obtained through a lens orto reproduce the image, to perform optical measurement, or to propagateor transmit an image. For example, the optical instrument according tothe embodiment may include a smart phone and a portable terminalequipped with a camera.

FIG. 20 is an exploded perspective view illustrating a camera module 200according to an embodiment.

Referring to FIG. 20 , the camera module 200 may include a lens or alens barrel 400, the lens moving apparatus 100, an adhesive member 612,a filter 610, a first holder 600, a second holder 800, an image sensor810, a motion sensor 820, a controller 830, and a connector 840.

The lens or the lens barrel 400 may be mounted in the bobbin 110 of thelens moving apparatus 100.

The first holder 600 may be located under the base 210 of the lensmoving apparatus 100. The filter 610 may be mounted on the first holder600, and the first holder 600 may have a raised portion 500 on which thefilter 610 is seated.

The adhesive member 612 may couple or attach the base 210 of the lensmoving apparatus 100 to the first holder 600. In addition to theattachment function described above, the adhesive member 612 may serveto prevent contaminants from entering the lens moving apparatus 100.

The adhesive member 612 may be, for example, epoxy, thermohardeningadhesive, or ultraviolet hardening adhesive.

The filter 610 may serve to prevent light within a specific frequencyband that passes through the lens barrel 400 from being introduced intothe image sensor 810. The filter 610 may be, for example, aninfrared-light-blocking filter, without being limited thereto. Here, thefilter 610 may be oriented parallel to the X-Y plane.

The region of the first holder 600 in which the filter 610 is mountedmay be provided with an opening in order to allow the light that passesthrough the filter 610 to be introduced into the image sensor 810.

The second holder 800 may be disposed under the first holder 600, andthe image sensor 810 may be mounted on the second holder 600. The imagesensor 810 may be a portion on which an image included in the light thatpasses through the filter 610 and that is introduced thereinto isformed.

The second holder 800 may include, for example, various circuits,devices, and a controller in order to convert the image, formed on theimage sensor 810, into electrical signals and to transmit the electricalsignals to an external component.

The second holder 800 may be embodied as a circuit board on which theimage sensor 810 may be mounted, on which a circuit pattern may beformed, and to which various devices may be coupled.

The image sensor 810 may receive an image contained in the lightintroduced through the lens moving apparatus 100, 1100, 2100 and mayconvert the received image into electrical signals.

The filter 610 and the image sensor 810 may be spaced apart from eachother so as to be opposite each other in the first direction.

The motion sensor 820 may be mounted on the second holder 800, and maybe conductively connected to the controller 830 through the circuitpattern formed on the second holder 800.

The motion sensor 820 may output rotational angular speed caused bymotion. The motion sensor 820 may be embodied as a dual-axis ortriple-axis gyro sensor or an angular speed sensor.

The controller 830 may be mounted on the second holder 800. The secondholder 800 may be conductively connected to the lens moving apparatus100. For example, the second holder 800 may be conductively connected tothe first coil 120, the second coil 230 and the position sensor 240 ofthe lens moving apparatus 100.

For example, a drive signal may be supplied to each of the first coil120, the second coil 230 and the position sensor 240 through the secondholder 800.

The connector 840 may be conductively connected to the second holder800, and may have a port for the electrical connection of an externalcomponent.

FIG. 21 is a perspective view illustrating a portable terminal 200Aaccording to an embodiment. FIG. 22 is a view illustrating theconfiguration of the portable terminal 200A illustrated in FIG. 21 .

Referring to FIGS. 21 and 22 , the portable terminal 200A (hereinafterreferred to as a “terminal”) may include a body 850, a wirelesscommunication unit 710, an audio/video (A/V) input unit 720, a sensingunit 740, an input/output unit 750, a memory unit 760, an interface unit770, a controller 780, and a power supply unit 790.

The body 850 illustrated in FIG. 21 has a bar shape, without beinglimited thereto, and may be any of various types such as, for example, aslide type, a folder type, a swing type, or a swivel type, in which twoor more sub-bodies are coupled so as to be movable relative to eachother.

The body 850 may include a case (e.g. casing, housing, or cover)defining the external appearance of the terminal. For example, the body850 may be divided into a front case 851 and a rear case 852. Variouselectronic components of the terminal may be accommodated in the spacedefined between the front case 851 and the rear case 852.

The wireless communication unit 710 may include one or more modules,which enable wireless communication between the terminal 200A and awireless communication system or between the terminal 200A and a networkin which the terminal 200A is located. For example, the wirelesscommunication unit 710 may include a broadcast-receiving module 711, amobile communication module 712, a wireless Internet module 713, anearfield communication module 714, and a location information module715.

The A/V input unit 720 serves to input audio signals or video signals,and may include, for example, a camera 721 and a microphone 722.

The camera 721 may be the camera 200 including the camera module 200according to the embodiment shown in FIG. 20 .

The sensing unit 740 may sense the current state of the terminal 200A,such as, for example, the opening or closing of the terminal 200A, thelocation of the terminal 200A, the presence of a user's touch, theorientation of the terminal 200A, or the acceleration/deceleration ofthe terminal 200A, and may generate a sensing signal to control theoperation of the terminal 200A. When the terminal 200A is, for example,a slide-type cellular phone, the sensing unit 740 may sense whether theslide-type cellular phone is opened or closed. Furthermore, the sensingunit 740 may sense the supply of power from the power supply unit 790,coupling of the interface unit 770 to an external device and the like.

The input/output unit 750 serves to generate, for example, visual,audible, or tactile input or output. The input/output unit 750 maygenerate input data to control the operation of the terminal 200A, andmay display information processed in the terminal 200A.

The input/output unit 750 may include a keypad unit 730, a displaymodule 751, a sound output module 752, and a touchscreen panel 753. Thekeypad unit 730 may generate input data in response to input to akeypad.

The display module 751 may include a plurality of pixels, the color ofwhich varies in response to electrical signals applied thereto. Forexample, the display module 751 may include at least one among a liquidcrystal display, a thin-film-transistor-liquid crystal display, anorganic light-emitting diode, a flexible display and a 3D display.

The sound output module 752 may output audio data received from thewireless communication unit 710 in, for example, a call signal receptionmode, a call mode, a recording mode, a voice recognition mode, or abroadcast reception mode, or may output audio data stored in the memoryunit 760.

The touchscreen panel 753 may convert variation in capacitance, causedby a user's touch on a specific region of a touchscreen, into electricalinput signals.

The memory unit 760 may temporarily store programs for the processingand control of the controller 780, and input/output data (for example,telephone numbers, messages, audio data, stationary images, movingimages and the like). For example, the memory unit 760 may store imagescaptured by the camera 721, for example, pictures or moving images.

The interface unit 770 serves as a path through which the lens movingapparatus is connected to an external device connected to the terminal200A. The interface unit 770 may receive power or data from the externalcomponent, and may transmit the same to respective constituent elementsinside the terminal 200A, or may transmit data inside the terminal 200Ato the external component. For example, the interface unit 770 mayinclude a wired/wireless headset port, an external charger port, awired/wireless data port, a memory card port, a port for connection to adevice equipped with an identification module, an audio input/output(I/O) port, a video input/output (I/O) port, an earphone port and thelike.

The controller 780 may control the general operation of the terminal200A. For example, the controller 780 may perform control and processingrelated to, for example, voice calls, data communication, and videocalls.

The controller 780 may include a multimedia module 781 for multimediaplayback. The multimedia module 781 may be embodied in the controller180 or may be embodied separately from the controller 780.

The controller 780 may perform a pattern recognition process capable ofrecognizing writing input or drawing input carried out on a touch screenas a character and an image, respectively.

The power supply unit 790 may supply power required to operate therespective constituent elements upon receiving external power orinternal power under the control of the controller 780.

The features, configurations, effects and the like described above inthe embodiments are included in at least one embodiment, but theinvention is not limited only to the embodiments. In addition, thefeatures, configuration, effects and the like exemplified in therespective embodiments may be combined with other embodiments ormodified by those skilled in the art. Accordingly, content related tothese combinations and modifications should be construed as fallingwithin the scope of the embodiments.

The embodiments may be applied to a lens moving apparatus capable ofimproving ease of soldering of a circuit board to terminals andpreventing electrical disconnection of the terminals from the circuitboard, and to a camera module and an optical device each including thesame.

The invention claimed is:
 1. A lens moving apparatus comprising: ahousing; a bobbin disposed in the housing; a first coil disposed on thebobbin; a magnet disposed on the housing; an elastic member coupled bothto the bobbin and to the housing; a base disposed to be spaced apartfrom the housing; a circuit board disposed between the housing and thebase; a terminal disposed on the base; and a support connecting theelastic member and the terminal, wherein the terminal comprises: a firstcoupler comprising a circular hole with a first diameter; a secondcoupler coupled to the circuit board; and a connector connecting aportion of the first coupler to a portion of the second coupler, whereinthe support comprises a suspension wire having a second diameter lessthan the first diameter and having a first end passing through thecircular hole of the first coupler and being electrically coupled to thefirst coupler, wherein a second end of the suspension wire iselectrically connected to the elastic member, wherein a lower surface ofthe second coupler is positioned higher than an upper surface of thefirst coupler, and wherein an area of the second coupler is smaller thanan area of the first coupler.
 2. The lens moving apparatus according toclaim 1, wherein the connector comprises a curved portion or a bentportion.
 3. The lens moving apparatus according to claim 1, wherein,when viewed from above, a horizontal distance between the first couplerand the second coupler is less than a length of the second coupler in adirection from the first coupler toward the second coupler.
 4. The lensmoving apparatus according to claim 1, wherein, when viewed from above,a length of the connector is less than a length of the second coupler ina longitudinal direction of the connector, and wherein the length of theconnector is a distance between a first coupling region of the connectorconnected to a first side surface of the first coupler and a secondcoupling region of the connector connected to a first side surface ofthe second coupler.
 5. The lens moving apparatus according to claim 1,wherein when viewed from a top, the area of the second coupler is largerthan an area of the connector.
 6. The lens moving apparatus according toclaim 5, wherein a ratio of the area the connector to the area of thesecond coupler is 1:9 to 1:30.
 7. The lens moving apparatus according toclaim 1, wherein the second coupler is disposed between the base and thecircuit board, and wherein the first coupler is disposed lower than thesecond coupler.
 8. The lens moving apparatus according to claim 1,wherein the base comprises a protrusion, and wherein the terminalcomprises a hole coupled to the protrusion of the base.
 9. The lensmoving apparatus according to claim 1, wherein the elastic membercomprises a first elastic member disposed on an upper surface of thebobbin and a second elastic member disposed on a lower surface of thebobbin, wherein the support is coupled to the first elastic member, andwherein a width of the connector is less than a width of the firstcoupler.
 10. The lens moving apparatus according to claim 1, wherein,when viewed from above, a horizontal distance between the first couplerand the second coupler is 0.15 mm to 0.25 mm, and Wherein, when viewedfrom a side, a vertical distance between the first coupler and thesecond coupler is 0.03 mm to 0.07 mm.
 11. The lens moving apparatusaccording to claim 1, wherein the circuit board comprises a pad portioncoupled to the second coupler.
 12. The lens moving apparatus accordingto claim 11, comprising a solder disposed between the pad portion andthe second coupler.
 13. The lens moving apparatus according to claim 11,wherein the pad portion faces the second coupler of the terminal in anoptical axis direction.
 14. The lens moving apparatus according to claim1, comprising a solder coupled with one end of the support passingthrough the circular hole of the first coupler and a lower surface ofthe first coupler.
 15. A camera module comprising: a lens; a lens movingapparatus for mounting the lens according to claim 1; and an imagesensor.
 16. The lens moving apparatus according to claim 1, wherein thefirst end of the suspension wire passes through the circular hole of thefirst coupler without contacting inner circumference surfaces of thecircular hole.
 17. The lens moving apparatus according to claim 1,wherein the suspension wire comprises at least one single suspensionwire extending from the terminal to the elastic member at a corner ofthe housing.
 18. The lens moving apparatus according to claim 17,wherein the at least one single suspension wire extends in alongitudinal direction from the terminal to the elastic member.
 19. Thelens moving apparatus according to claim 1, wherein the suspension wirecomprises at least two single suspension wires extending from theterminal to the elastic member at one corner of the housing.
 20. Thelens moving apparatus according to claim 1, wherein the suspension wireextends from the terminal to the elastic member without contacting othercomponents of the lens moving apparatus disposed between the terminaland the elastic member.
 21. The lens moving apparatus according to claim1, wherein the second diameter of the suspension wire is less than aradius of the circular hole.
 22. The lens moving apparatus according toclaim 1, wherein the first end of the suspension wire is coupled to thefirst coupler by a solder.
 23. The lens moving apparatus according toclaim 1, wherein a width of the connector is less than a width of thefirst coupler.
 24. A lens moving apparatus comprising: a housing; abobbin disposed in the housing; a first coil disposed on the bobbin; amagnet disposed on the housing; an elastic member coupled to thehousing; a base disposed to be spaced apart from the housing; a circuitboard disposed between the housing and the base; a terminal disposed onthe base; and a support connecting the elastic member and the terminal,wherein the terminal comprises: a first coupler comprising a circularhole having a first diameter; a second coupler coupled to the circuitboard; and a connector connecting a portion of the first coupler and aportion of the second coupler, wherein the support comprises asuspension wire having a second diameter less than the first diameterand having a first end passing through the circular hole of the firstcoupler and being electrically coupled to the first coupler, wherein asecond end of the suspension wire is electrically connected to theelastic member, wherein the connector comprises a curved portion or abent portion, wherein a lower surface of the second coupler ispositioned higher than an upper surface of the first coupler, andwherein a width of the connector is less than a width of the firstcoupler.
 25. A lens moving apparatus comprising: a base; a circuit boarddisposed on the base and comprising a pad portion; a housing disposed tobe spaced apart from the base; a bobbin disposed in the housing; a firstcoil disposed on the bobbin; a magnet disposed on the housing andcomprising a first coupler comprising a circular hole with a firstdiameter and a second coupler coupled to the pad portion of the circuitboard; a solder connecting the pad portion of the circuit board and thesecond coupler; an elastic member coupled both to the bobbin and to thehousing; a terminal disposed on the base; and a support connecting theelastic member and the terminal, wherein the support comprises asuspension wire having a second diameter less than the first diameterand having a first end passing through the circular hole of the firstcoupler and being electrically coupled to the first coupler, wherein asecond end of the suspension wire is electrically connected to theelastic member, wherein a lower surface of the second coupler ispositioned higher than an upper surface of the first coupler, andwherein an area of the second coupler is smaller than an area of thefirst coupler.
 26. The lens moving apparatus according to claim 25,wherein a width of the connector is less than a width of the firstcoupler.